JPS5617196A - Ultrasonic wire bonding method - Google Patents

Ultrasonic wire bonding method

Info

Publication number
JPS5617196A
JPS5617196A JP9347979A JP9347979A JPS5617196A JP S5617196 A JPS5617196 A JP S5617196A JP 9347979 A JP9347979 A JP 9347979A JP 9347979 A JP9347979 A JP 9347979A JP S5617196 A JPS5617196 A JP S5617196A
Authority
JP
Japan
Prior art keywords
waveform
bonding
memory
computer
inputted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9347979A
Other languages
Japanese (ja)
Inventor
Nobuhito Yamazaki
Takeshi Hasegawa
Masayuki Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP9347979A priority Critical patent/JPS5617196A/en
Publication of JPS5617196A publication Critical patent/JPS5617196A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To automatically discriminate whether the condition of titled bonding is good or not during bonding by storing the shape of the oscillation output waveforms at the wire bonding into a memory and comparing the waveform thereof with the waveform having beforehand been inputted.
CONSTITUTION: A transducer 2 is machanically vibrated by the constant voltage output from an ultrasonic wave oscillating electric source 1 and a tool 4 is vibrated via a horn 3, by which a wire 5 is bonded to the sample in the state that it is held pressed thereto. The current waveform of this time is shaped by a waveform shaping circuit 8, and the thus obtained current shaped waveform is inputted via an AD converter 9 and a DMA control unit 10 to the memory 12 of a microcomputer 11. On the other hand, an ideal waveform is beforehand inputted to the computer 11 and whether the bonding condition is good or not is discriminated by checking the current waveform having been stored in the memory 12 with the computer 11. In addition, the computer 11 emits a command to a bonding device control section 13 at a proper time so that the oscillation of the electric power source 1 is stopped.
COPYRIGHT: (C)1981,JPO&Japio
JP9347979A 1979-07-23 1979-07-23 Ultrasonic wire bonding method Pending JPS5617196A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9347979A JPS5617196A (en) 1979-07-23 1979-07-23 Ultrasonic wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9347979A JPS5617196A (en) 1979-07-23 1979-07-23 Ultrasonic wire bonding method

Publications (1)

Publication Number Publication Date
JPS5617196A true JPS5617196A (en) 1981-02-18

Family

ID=14083469

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9347979A Pending JPS5617196A (en) 1979-07-23 1979-07-23 Ultrasonic wire bonding method

Country Status (1)

Country Link
JP (1) JPS5617196A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06232232A (en) * 1992-01-27 1994-08-19 U C Japan Kk Method and apparatus for evaluating ultrasonic wire bonding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06232232A (en) * 1992-01-27 1994-08-19 U C Japan Kk Method and apparatus for evaluating ultrasonic wire bonding

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