JPS56169349A - Marking device for electronic component - Google Patents

Marking device for electronic component

Info

Publication number
JPS56169349A
JPS56169349A JP7139380A JP7139380A JPS56169349A JP S56169349 A JPS56169349 A JP S56169349A JP 7139380 A JP7139380 A JP 7139380A JP 7139380 A JP7139380 A JP 7139380A JP S56169349 A JPS56169349 A JP S56169349A
Authority
JP
Japan
Prior art keywords
diodes
drum
marking
polarity
conveyor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7139380A
Other languages
English (en)
Japanese (ja)
Other versions
JPS631754B2 (cg-RX-API-DMAC7.html
Inventor
Tokuichiro Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7139380A priority Critical patent/JPS56169349A/ja
Publication of JPS56169349A publication Critical patent/JPS56169349A/ja
Publication of JPS631754B2 publication Critical patent/JPS631754B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/544Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54473Marks applied to semiconductor devices or parts for use after dicing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Duplication Or Marking (AREA)
JP7139380A 1980-05-30 1980-05-30 Marking device for electronic component Granted JPS56169349A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7139380A JPS56169349A (en) 1980-05-30 1980-05-30 Marking device for electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7139380A JPS56169349A (en) 1980-05-30 1980-05-30 Marking device for electronic component

Publications (2)

Publication Number Publication Date
JPS56169349A true JPS56169349A (en) 1981-12-26
JPS631754B2 JPS631754B2 (cg-RX-API-DMAC7.html) 1988-01-13

Family

ID=13459221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7139380A Granted JPS56169349A (en) 1980-05-30 1980-05-30 Marking device for electronic component

Country Status (1)

Country Link
JP (1) JPS56169349A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6028759U (ja) * 1983-07-29 1985-02-26 ロ−ム株式会社 レ−ザ−標印機におけるマスクホルダ−およびマスクの組合せ
CN108790393A (zh) * 2018-07-13 2018-11-13 济南鲁晶半导体有限公司 一种轴向封装二极管的印字设备

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4858776A (en) * 1988-11-03 1989-08-22 Nalge Company Bottle closure assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6028759U (ja) * 1983-07-29 1985-02-26 ロ−ム株式会社 レ−ザ−標印機におけるマスクホルダ−およびマスクの組合せ
CN108790393A (zh) * 2018-07-13 2018-11-13 济南鲁晶半导体有限公司 一种轴向封装二极管的印字设备
CN108790393B (zh) * 2018-07-13 2024-05-03 济南鲁晶半导体有限公司 一种轴向封装二极管的印字设备

Also Published As

Publication number Publication date
JPS631754B2 (cg-RX-API-DMAC7.html) 1988-01-13

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