JPS56161411A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPS56161411A JPS56161411A JP6560380A JP6560380A JPS56161411A JP S56161411 A JPS56161411 A JP S56161411A JP 6560380 A JP6560380 A JP 6560380A JP 6560380 A JP6560380 A JP 6560380A JP S56161411 A JPS56161411 A JP S56161411A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- dap
- resin composition
- precopolymer
- consisting mainly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Polymerisation Methods In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
PURPOSE: A resin composition which can be cured with an organic peroxide or an ionizing radiation, and forms a heat-resistant molding excellent in mechanical and electrical properties, consisting mainly of a precopolymer of diallyl phthalate and triallyl isocyanurate.
CONSTITUTION: A resin composition consisting mainly of a precopolymer of diallyl phthalate (hereinafter abbreviated as DAP) and triallyl diisocyanurate (hereinafter abbreviated as TAIC). DAP resin is excellent in electrical properties, particularly in electrical properties at wet, and also excellent in mechanical properties, particularly in dimensional stability. The resin, however, has a defect that the resin is difficult to satisfy the requirements of class H (180°C) for heat resistance. When the resin composition consisting mainly of the DAP-TAIC precopolymer is cured with an organic peroxide or an ionizing radiation, it is possible to impart heat resistance corresponding to class H with lowering the properties of DAP resin.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6560380A JPS6021687B2 (en) | 1980-05-16 | 1980-05-16 | resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6560380A JPS6021687B2 (en) | 1980-05-16 | 1980-05-16 | resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56161411A true JPS56161411A (en) | 1981-12-11 |
JPS6021687B2 JPS6021687B2 (en) | 1985-05-29 |
Family
ID=13291751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6560380A Expired JPS6021687B2 (en) | 1980-05-16 | 1980-05-16 | resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6021687B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61235410A (en) * | 1985-04-11 | 1986-10-20 | Res Inst For Prod Dev | Production of rigid gel molding containing isocyanuric ring |
JPH03281513A (en) * | 1990-03-29 | 1991-12-12 | Nippon Kasei Chem Co Ltd | Liquid composition |
WO2018037912A1 (en) * | 2016-08-22 | 2018-03-01 | 株式会社大阪ソーダ | Photocurable resin composition, ink and coating material |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0541349Y2 (en) * | 1986-09-19 | 1993-10-19 |
-
1980
- 1980-05-16 JP JP6560380A patent/JPS6021687B2/en not_active Expired
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61235410A (en) * | 1985-04-11 | 1986-10-20 | Res Inst For Prod Dev | Production of rigid gel molding containing isocyanuric ring |
JPH0542445B2 (en) * | 1985-04-11 | 1993-06-28 | Seisan Kaihatsu Kagaku Kenkyus | |
JPH03281513A (en) * | 1990-03-29 | 1991-12-12 | Nippon Kasei Chem Co Ltd | Liquid composition |
WO2018037912A1 (en) * | 2016-08-22 | 2018-03-01 | 株式会社大阪ソーダ | Photocurable resin composition, ink and coating material |
CN109641985A (en) * | 2016-08-22 | 2019-04-16 | 株式会社大阪曹达 | Photocurable resin composition, ink and coating |
JPWO2018037912A1 (en) * | 2016-08-22 | 2019-06-20 | 株式会社大阪ソーダ | Photocurable resin composition, ink and paint |
US11149157B2 (en) | 2016-08-22 | 2021-10-19 | Osaka Soda Co., Ltd. | Photocurable resin composition, ink and coating material |
CN109641985B (en) * | 2016-08-22 | 2022-04-22 | 株式会社大阪曹达 | Photocurable resin composition, ink, and coating material |
TWI808944B (en) * | 2016-08-22 | 2023-07-21 | 日商大阪曹達股份有限公司 | Photocurable resin composition, ink and paint |
Also Published As
Publication number | Publication date |
---|---|
JPS6021687B2 (en) | 1985-05-29 |
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