JPS56161350U - Semiconductor package for pressure sensor - Google Patents

Semiconductor package for pressure sensor

Info

Publication number
JPS56161350U
JPS56161350U JP1980058597U JP5859780U JPS56161350U JP S56161350 U JPS56161350 U JP S56161350U JP 1980058597 U JP1980058597 U JP 1980058597U JP 5859780 U JP5859780 U JP 5859780U JP S56161350 U JPS56161350 U JP S56161350U
Authority
JP
Japan
Prior art keywords
pressure sensor
semiconductor package
package
semiconductor
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980058597U
Other languages
Japanese (ja)
Other versions
JPS5934150Y2 (en
Inventor
Eizo Otozu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyoto Ceramic Co Ltd
Original Assignee
Kyoto Ceramic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyoto Ceramic Co Ltd filed Critical Kyoto Ceramic Co Ltd
Priority to JP1980058597U priority Critical patent/JPS5934150Y2/en
Publication of JPS56161350U publication Critical patent/JPS56161350U/en
Application granted granted Critical
Publication of JPS5934150Y2 publication Critical patent/JPS5934150Y2/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
JP1980058597U 1980-04-28 1980-04-28 Semiconductor element package for pressure sensor Expired JPS5934150Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980058597U JPS5934150Y2 (en) 1980-04-28 1980-04-28 Semiconductor element package for pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980058597U JPS5934150Y2 (en) 1980-04-28 1980-04-28 Semiconductor element package for pressure sensor

Publications (2)

Publication Number Publication Date
JPS56161350U true JPS56161350U (en) 1981-12-01
JPS5934150Y2 JPS5934150Y2 (en) 1984-09-21

Family

ID=29653076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980058597U Expired JPS5934150Y2 (en) 1980-04-28 1980-04-28 Semiconductor element package for pressure sensor

Country Status (1)

Country Link
JP (1) JPS5934150Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007253323A (en) * 2006-03-24 2007-10-04 Infineon Technologies Sensonor As Integral pedestal mount for mems structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007253323A (en) * 2006-03-24 2007-10-04 Infineon Technologies Sensonor As Integral pedestal mount for mems structure

Also Published As

Publication number Publication date
JPS5934150Y2 (en) 1984-09-21

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