JPS56161340U - - Google Patents
Info
- Publication number
- JPS56161340U JPS56161340U JP1980058413U JP5841380U JPS56161340U JP S56161340 U JPS56161340 U JP S56161340U JP 1980058413 U JP1980058413 U JP 1980058413U JP 5841380 U JP5841380 U JP 5841380U JP S56161340 U JPS56161340 U JP S56161340U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0711—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980058413U JPS56161340U (esLanguage) | 1980-04-28 | 1980-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980058413U JPS56161340U (esLanguage) | 1980-04-28 | 1980-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56161340U true JPS56161340U (esLanguage) | 1981-12-01 |
Family
ID=29652895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980058413U Pending JPS56161340U (esLanguage) | 1980-04-28 | 1980-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56161340U (esLanguage) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58131741A (ja) * | 1982-01-29 | 1983-08-05 | Shinkawa Ltd | ペレットボンディング用フラックス付け装置 |
| JPS5925232A (ja) * | 1982-07-31 | 1984-02-09 | Shinkawa Ltd | ワイヤボンディング装置 |
| JPS6016430A (ja) * | 1983-07-08 | 1985-01-28 | Toshiba Corp | 半導体装置の製造方法 |
| JPH0258331U (esLanguage) * | 1988-10-24 | 1990-04-26 |
-
1980
- 1980-04-28 JP JP1980058413U patent/JPS56161340U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58131741A (ja) * | 1982-01-29 | 1983-08-05 | Shinkawa Ltd | ペレットボンディング用フラックス付け装置 |
| JPS5925232A (ja) * | 1982-07-31 | 1984-02-09 | Shinkawa Ltd | ワイヤボンディング装置 |
| JPS6016430A (ja) * | 1983-07-08 | 1985-01-28 | Toshiba Corp | 半導体装置の製造方法 |
| JPH0258331U (esLanguage) * | 1988-10-24 | 1990-04-26 |