JPS56159037U - - Google Patents

Info

Publication number
JPS56159037U
JPS56159037U JP5792180U JP5792180U JPS56159037U JP S56159037 U JPS56159037 U JP S56159037U JP 5792180 U JP5792180 U JP 5792180U JP 5792180 U JP5792180 U JP 5792180U JP S56159037 U JPS56159037 U JP S56159037U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5792180U
Other languages
Japanese (ja)
Other versions
JPS5745959Y2 (un
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980057921U priority Critical patent/JPS5745959Y2/ja
Publication of JPS56159037U publication Critical patent/JPS56159037U/ja
Application granted granted Critical
Publication of JPS5745959Y2 publication Critical patent/JPS5745959Y2/ja
Expired legal-status Critical Current

Links

JP1980057921U 1980-04-25 1980-04-25 Expired JPS5745959Y2 (un)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980057921U JPS5745959Y2 (un) 1980-04-25 1980-04-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980057921U JPS5745959Y2 (un) 1980-04-25 1980-04-25

Publications (2)

Publication Number Publication Date
JPS56159037U true JPS56159037U (un) 1981-11-27
JPS5745959Y2 JPS5745959Y2 (un) 1982-10-09

Family

ID=29652404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980057921U Expired JPS5745959Y2 (un) 1980-04-25 1980-04-25

Country Status (1)

Country Link
JP (1) JPS5745959Y2 (un)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7042068B2 (en) 2000-04-27 2006-05-09 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
US6905914B1 (en) 2002-11-08 2005-06-14 Amkor Technology, Inc. Wafer level package and fabrication method
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US8324511B1 (en) 2010-04-06 2012-12-04 Amkor Technology, Inc. Through via nub reveal method and structure
US8440554B1 (en) 2010-08-02 2013-05-14 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US8487445B1 (en) 2010-10-05 2013-07-16 Amkor Technology, Inc. Semiconductor device having through electrodes protruding from dielectric layer
US8552548B1 (en) 2011-11-29 2013-10-08 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636448U (un) * 1979-08-29 1981-04-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636448U (un) * 1979-08-29 1981-04-08

Also Published As

Publication number Publication date
JPS5745959Y2 (un) 1982-10-09

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