JPS5615801Y2 - - Google Patents

Info

Publication number
JPS5615801Y2
JPS5615801Y2 JP1972090525U JP9052572U JPS5615801Y2 JP S5615801 Y2 JPS5615801 Y2 JP S5615801Y2 JP 1972090525 U JP1972090525 U JP 1972090525U JP 9052572 U JP9052572 U JP 9052572U JP S5615801 Y2 JPS5615801 Y2 JP S5615801Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1972090525U
Other languages
Japanese (ja)
Other versions
JPS4947565U (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1972090525U priority Critical patent/JPS5615801Y2/ja
Publication of JPS4947565U publication Critical patent/JPS4947565U/ja
Application granted granted Critical
Publication of JPS5615801Y2 publication Critical patent/JPS5615801Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1972090525U 1972-07-31 1972-07-31 Expired JPS5615801Y2 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1972090525U JPS5615801Y2 (zh) 1972-07-31 1972-07-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972090525U JPS5615801Y2 (zh) 1972-07-31 1972-07-31

Publications (2)

Publication Number Publication Date
JPS4947565U JPS4947565U (zh) 1974-04-25
JPS5615801Y2 true JPS5615801Y2 (zh) 1981-04-14

Family

ID=28278113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1972090525U Expired JPS5615801Y2 (zh) 1972-07-31 1972-07-31

Country Status (1)

Country Link
JP (1) JPS5615801Y2 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123077A (en) * 1974-08-20 1976-02-24 Matsushita Electronics Corp Denkyokuriidosenno setsuzokuhoho
JPS5559805U (zh) * 1978-10-18 1980-04-23

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4942831A (zh) * 1972-07-31 1974-04-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4942831A (zh) * 1972-07-31 1974-04-22

Also Published As

Publication number Publication date
JPS4947565U (zh) 1974-04-25

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