JPS5615801Y2 - - Google Patents

Info

Publication number
JPS5615801Y2
JPS5615801Y2 JP1972090525U JP9052572U JPS5615801Y2 JP S5615801 Y2 JPS5615801 Y2 JP S5615801Y2 JP 1972090525 U JP1972090525 U JP 1972090525U JP 9052572 U JP9052572 U JP 9052572U JP S5615801 Y2 JPS5615801 Y2 JP S5615801Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1972090525U
Other languages
Japanese (ja)
Other versions
JPS4947565U (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1972090525U priority Critical patent/JPS5615801Y2/ja
Publication of JPS4947565U publication Critical patent/JPS4947565U/ja
Application granted granted Critical
Publication of JPS5615801Y2 publication Critical patent/JPS5615801Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1972090525U 1972-07-31 1972-07-31 Expired JPS5615801Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1972090525U JPS5615801Y2 (enrdf_load_html_response) 1972-07-31 1972-07-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972090525U JPS5615801Y2 (enrdf_load_html_response) 1972-07-31 1972-07-31

Publications (2)

Publication Number Publication Date
JPS4947565U JPS4947565U (enrdf_load_html_response) 1974-04-25
JPS5615801Y2 true JPS5615801Y2 (enrdf_load_html_response) 1981-04-14

Family

ID=28278113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1972090525U Expired JPS5615801Y2 (enrdf_load_html_response) 1972-07-31 1972-07-31

Country Status (1)

Country Link
JP (1) JPS5615801Y2 (enrdf_load_html_response)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123077A (en) * 1974-08-20 1976-02-24 Matsushita Electronics Corp Denkyokuriidosenno setsuzokuhoho
JPS5559805U (enrdf_load_html_response) * 1978-10-18 1980-04-23

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3862976A (en) * 1972-07-31 1975-01-28 Morton Norwich Products Inc Isocyanophenyl carbamates

Also Published As

Publication number Publication date
JPS4947565U (enrdf_load_html_response) 1974-04-25

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