JPS5615577B2 - - Google Patents
Info
- Publication number
- JPS5615577B2 JPS5615577B2 JP12410473A JP12410473A JPS5615577B2 JP S5615577 B2 JPS5615577 B2 JP S5615577B2 JP 12410473 A JP12410473 A JP 12410473A JP 12410473 A JP12410473 A JP 12410473A JP S5615577 B2 JPS5615577 B2 JP S5615577B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US00313366A US3842491A (en) | 1972-12-08 | 1972-12-08 | Manufacture of assorted types of lsi devices on same wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4990085A JPS4990085A (US07642317-20100105-C00010.png) | 1974-08-28 |
| JPS5615577B2 true JPS5615577B2 (US07642317-20100105-C00010.png) | 1981-04-10 |
Family
ID=23215433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12410473A Expired JPS5615577B2 (US07642317-20100105-C00010.png) | 1972-12-08 | 1973-11-06 |
Country Status (5)
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3048362A1 (de) * | 1980-12-20 | 1982-07-29 | Deutsche Itt Industries Gmbh, 7800 Freiburg | "verfahren zur herstellung von halbleiterbauelementen" |
| US4796194A (en) * | 1986-08-20 | 1989-01-03 | Atherton Robert W | Real world modeling and control process |
| JP3309478B2 (ja) * | 1993-02-26 | 2002-07-29 | ソニー株式会社 | チップ管理システムおよびその入力処理方法とロット処理方法およびチップ管理システムによるチップ製造方法 |
| TW248612B (US07642317-20100105-C00010.png) * | 1993-03-31 | 1995-06-01 | Siemens Ag | |
| US5773315A (en) * | 1996-10-28 | 1998-06-30 | Advanced Micro Devices, Inc. | Product wafer yield prediction method employing a unit cell approach |
| US5719605A (en) * | 1996-11-20 | 1998-02-17 | Lexmark International, Inc. | Large array heater chips for thermal ink jet printheads |
| US5916715A (en) * | 1997-09-08 | 1999-06-29 | Advanced Micro Devices, Inc. | Process of using electrical signals for determining lithographic misalignment of vias relative to electrically active elements |
| US6118137A (en) * | 1997-09-08 | 2000-09-12 | Advanced Micro Devices, Inc. | Test structure responsive to electrical signals for determining lithographic misalignment of conductors relative to vias |
| US6070004A (en) * | 1997-09-25 | 2000-05-30 | Siemens Aktiengesellschaft | Method of maximizing chip yield for semiconductor wafers |
| US6359461B1 (en) | 1998-02-10 | 2002-03-19 | Advanced Micro Devices, Inc. | Test structure for determining the properties of densely packed transistors |
| US5986283A (en) * | 1998-02-25 | 1999-11-16 | Advanced Micro Devices | Test structure for determining how lithographic patterning of a gate conductor affects transistor properties |
| US6380554B1 (en) | 1998-06-08 | 2002-04-30 | Advanced Micro Devices, Inc. | Test structure for electrically measuring the degree of misalignment between successive layers of conductors |
| US6226781B1 (en) | 1998-08-12 | 2001-05-01 | Advanced Micro Devices, Inc. | Modifying a design layer of an integrated circuit using overlying and underlying design layers |
| US6294397B1 (en) | 1999-03-04 | 2001-09-25 | Advanced Micro Devices, Inc. | Drop-in test structure and abbreviated integrated circuit process flow for characterizing production integrated circuit process flow, topography, and equipment |
| US6452412B1 (en) | 1999-03-04 | 2002-09-17 | Advanced Micro Devices, Inc. | Drop-in test structure and methodology for characterizing an integrated circuit process flow and topography |
| US6268717B1 (en) | 1999-03-04 | 2001-07-31 | Advanced Micro Devices, Inc. | Semiconductor test structure with intentional partial defects and method of use |
| US6297644B1 (en) | 1999-03-04 | 2001-10-02 | Advanced Micro Devices, Inc. | Multipurpose defect test structure with switchable voltage contrast capability and method of use |
| US6258437B1 (en) | 1999-03-31 | 2001-07-10 | Advanced Micro Devices, Inc. | Test structure and methodology for characterizing etching in an integrated circuit fabrication process |
| US6834262B1 (en) | 1999-07-02 | 2004-12-21 | Cypress Semiconductor Corporation | Scheme for improving the simulation accuracy of integrated circuit patterns by simulation of the mask |
| US6429452B1 (en) | 1999-08-17 | 2002-08-06 | Advanced Micro Devices, Inc. | Test structure and methodology for characterizing ion implantation in an integrated circuit fabrication process |
| US6681376B1 (en) * | 2001-10-17 | 2004-01-20 | Cypress Semiconductor Corporation | Integrated scheme for semiconductor device verification |
| JP4137471B2 (ja) * | 2002-03-04 | 2008-08-20 | 東京エレクトロン株式会社 | ダイシング方法、集積回路チップの検査方法及び基板保持装置 |
| US20040219443A1 (en) * | 2003-05-01 | 2004-11-04 | Spears Kurt E. | Method for wafer dicing |
| US7861203B2 (en) * | 2006-12-29 | 2010-12-28 | Cadence Design Systems, Inc. | Method and system for model-based routing of an integrated circuit |
| US7698666B2 (en) * | 2006-12-29 | 2010-04-13 | Cadence Design Systems, Inc. | Method and system for model-based design and layout of an integrated circuit |
| US8234597B2 (en) * | 2008-01-14 | 2012-07-31 | International Business Machines Corporation | Tool and method to graphically correlate process and test data with specific chips on a wafer |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1001908A (en) * | 1962-08-31 | 1965-08-18 | Texas Instruments Inc | Semiconductor devices |
| US3385702A (en) * | 1962-10-03 | 1968-05-28 | Ibm | Photomechanical method of making metallic patterns |
| US3702025A (en) * | 1969-05-12 | 1972-11-07 | Honeywell Inc | Discretionary interconnection process |
| US3762037A (en) * | 1971-03-30 | 1973-10-02 | Ibm | Method of testing for the operability of integrated semiconductor circuits having a plurality of separable circuits |
| US3720309A (en) * | 1971-12-07 | 1973-03-13 | Teledyne Inc | Method and apparatus for sorting semiconductor dice |
-
1972
- 1972-12-08 US US00313366A patent/US3842491A/en not_active Expired - Lifetime
-
1973
- 1973-10-04 GB GB4630773A patent/GB1400315A/en not_active Expired
- 1973-10-23 FR FR7338739A patent/FR2210016B1/fr not_active Expired
- 1973-10-27 DE DE19732353999 patent/DE2353999A1/de active Pending
- 1973-11-06 JP JP12410473A patent/JPS5615577B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2210016A1 (US07642317-20100105-C00010.png) | 1974-07-05 |
| FR2210016B1 (US07642317-20100105-C00010.png) | 1976-10-01 |
| US3842491A (en) | 1974-10-22 |
| DE2353999A1 (de) | 1974-06-12 |
| GB1400315A (en) | 1975-07-16 |
| JPS4990085A (US07642317-20100105-C00010.png) | 1974-08-28 |
