JPS5615142B2 - - Google Patents
Info
- Publication number
- JPS5615142B2 JPS5615142B2 JP12026975A JP12026975A JPS5615142B2 JP S5615142 B2 JPS5615142 B2 JP S5615142B2 JP 12026975 A JP12026975 A JP 12026975A JP 12026975 A JP12026975 A JP 12026975A JP S5615142 B2 JPS5615142 B2 JP S5615142B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
- C23C14/025—Metallic sublayers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50120269A JPS5244572A (en) | 1975-08-29 | 1975-08-29 | Method of ion plating diamond |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50120269A JPS5244572A (en) | 1975-08-29 | 1975-08-29 | Method of ion plating diamond |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5244572A JPS5244572A (en) | 1977-04-07 |
| JPS5615142B2 true JPS5615142B2 (en:Method) | 1981-04-08 |
Family
ID=14782025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50120269A Granted JPS5244572A (en) | 1975-08-29 | 1975-08-29 | Method of ion plating diamond |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5244572A (en:Method) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53138989A (en) * | 1977-05-10 | 1978-12-04 | Koyo Seiko Co | Ion plating method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5144866B2 (en:Method) * | 1972-01-27 | 1976-12-01 | ||
| JPS5147575B2 (en:Method) * | 1973-01-29 | 1976-12-15 |
-
1975
- 1975-08-29 JP JP50120269A patent/JPS5244572A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5244572A (en) | 1977-04-07 |