JPS56141470U - - Google Patents

Info

Publication number
JPS56141470U
JPS56141470U JP1981035303U JP3530381U JPS56141470U JP S56141470 U JPS56141470 U JP S56141470U JP 1981035303 U JP1981035303 U JP 1981035303U JP 3530381 U JP3530381 U JP 3530381U JP S56141470 U JPS56141470 U JP S56141470U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981035303U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS56141470U publication Critical patent/JPS56141470U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP1981035303U 1980-03-17 1981-03-13 Pending JPS56141470U (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/130,679 US4310811A (en) 1980-03-17 1980-03-17 Reworkable multi-layer printed circuit board

Publications (1)

Publication Number Publication Date
JPS56141470U true JPS56141470U (enExample) 1981-10-26

Family

ID=22445824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981035303U Pending JPS56141470U (enExample) 1980-03-17 1981-03-13

Country Status (3)

Country Link
US (1) US4310811A (enExample)
JP (1) JPS56141470U (enExample)
DE (1) DE3107405C2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02913Y2 (enExample) * 1985-02-05 1990-01-10
US4918260A (en) * 1985-07-26 1990-04-17 Preleg, Inc. Adhesive-coated wire and method and printed circuit board using same
EP0396869A1 (de) * 1989-05-09 1990-11-14 Thomas Matouschek Alarmvorrichtung zur Sicherung von Flächen
US5214250A (en) * 1991-09-19 1993-05-25 International Business Machines Corporation Method of reworking circuit panels, and circuit panels reworked thereby
US5646368A (en) * 1995-11-30 1997-07-08 International Business Machines Corporation Printed circuit board with an integrated twisted pair conductor
US6253675B1 (en) 1999-06-29 2001-07-03 Carl P. Mayer Solder paste stenciling apparatus and method of use for rework
JP3877132B2 (ja) * 2000-11-20 2007-02-07 富士通株式会社 多層配線基板及び半導体装置
US6651322B1 (en) * 2000-12-28 2003-11-25 Unisys Corporation Method of reworking a multilayer printed circuit board assembly
DE102009047431A1 (de) * 2009-12-03 2011-06-09 Robert Bosch Gmbh Verbindungselement und Verfahren zum Herstellen des Verbindungselements

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3530411A (en) * 1969-02-10 1970-09-22 Bunker Ramo High frequency electronic circuit structure employing planar transmission lines
US3605063A (en) * 1969-03-12 1971-09-14 Marvin C Stewart System for interconnecting electrical components
US3711626A (en) * 1969-09-29 1973-01-16 Texas Instruments Inc Circuit board
US3674602A (en) * 1969-10-09 1972-07-04 Photocircuits Corp Apparatus for making wire scribed circuit boards
US3646246A (en) * 1970-05-22 1972-02-29 Honeywell Inf Systems Circuit board and method of making
GB1501500A (en) * 1975-06-20 1978-02-15 Int Computers Ltd Multilayer printed circuit boards
DE2627297C2 (de) * 1975-06-20 1982-06-03 International Computers Ltd., London Mehrschichtige, gedruckte Schaltungsplatte
GB1589519A (en) * 1976-11-19 1981-05-13 Solartron Electronic Group Printed circuits
US4202007A (en) * 1978-06-23 1980-05-06 International Business Machines Corporation Multi-layer dielectric planar structure having an internal conductor pattern characterized with opposite terminations disposed at a common edge surface of the layers

Also Published As

Publication number Publication date
DE3107405C2 (de) 1983-01-20
US4310811A (en) 1982-01-12
DE3107405A1 (de) 1982-01-28

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