JPS56130982U - - Google Patents
Info
- Publication number
- JPS56130982U JPS56130982U JP2838180U JP2838180U JPS56130982U JP S56130982 U JPS56130982 U JP S56130982U JP 2838180 U JP2838180 U JP 2838180U JP 2838180 U JP2838180 U JP 2838180U JP S56130982 U JPS56130982 U JP S56130982U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2838180U JPS6022383Y2 (ja) | 1980-03-04 | 1980-03-04 | 発光ダイオ−ド表示器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2838180U JPS6022383Y2 (ja) | 1980-03-04 | 1980-03-04 | 発光ダイオ−ド表示器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56130982U true JPS56130982U (en, 2012) | 1981-10-05 |
JPS6022383Y2 JPS6022383Y2 (ja) | 1985-07-03 |
Family
ID=29624303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2838180U Expired JPS6022383Y2 (ja) | 1980-03-04 | 1980-03-04 | 発光ダイオ−ド表示器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6022383Y2 (en, 2012) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6045079A (ja) * | 1983-08-23 | 1985-03-11 | Honda Motor Co Ltd | 発光ダイオ−ドを用いたフレキシブルランプ |
JP2005209930A (ja) * | 2004-01-23 | 2005-08-04 | Seiko Epson Corp | 光源装置及びプロジェクタ |
JP2006128562A (ja) * | 2004-11-01 | 2006-05-18 | Nikon Corp | 発光装置 |
JP2013102207A (ja) * | 2007-07-30 | 2013-05-23 | Intellectual Discovery Co Ltd | 高められた熱伝導度を有するled光源 |
JP7117706B1 (ja) * | 2022-04-09 | 2022-08-15 | エレファンテック株式会社 | 表示装置及びその製造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000269551A (ja) * | 1999-03-18 | 2000-09-29 | Rohm Co Ltd | チップ型発光装置 |
-
1980
- 1980-03-04 JP JP2838180U patent/JPS6022383Y2/ja not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6045079A (ja) * | 1983-08-23 | 1985-03-11 | Honda Motor Co Ltd | 発光ダイオ−ドを用いたフレキシブルランプ |
JP2005209930A (ja) * | 2004-01-23 | 2005-08-04 | Seiko Epson Corp | 光源装置及びプロジェクタ |
JP2006128562A (ja) * | 2004-11-01 | 2006-05-18 | Nikon Corp | 発光装置 |
JP2013102207A (ja) * | 2007-07-30 | 2013-05-23 | Intellectual Discovery Co Ltd | 高められた熱伝導度を有するled光源 |
JP7117706B1 (ja) * | 2022-04-09 | 2022-08-15 | エレファンテック株式会社 | 表示装置及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6022383Y2 (ja) | 1985-07-03 |