JPS56129759U - - Google Patents

Info

Publication number
JPS56129759U
JPS56129759U JP2615980U JP2615980U JPS56129759U JP S56129759 U JPS56129759 U JP S56129759U JP 2615980 U JP2615980 U JP 2615980U JP 2615980 U JP2615980 U JP 2615980U JP S56129759 U JPS56129759 U JP S56129759U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2615980U
Other languages
Japanese (ja)
Other versions
JPS6234456Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980026159U priority Critical patent/JPS6234456Y2/ja
Publication of JPS56129759U publication Critical patent/JPS56129759U/ja
Application granted granted Critical
Publication of JPS6234456Y2 publication Critical patent/JPS6234456Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
JP1980026159U 1980-03-03 1980-03-03 Expired JPS6234456Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980026159U JPS6234456Y2 (enrdf_load_stackoverflow) 1980-03-03 1980-03-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980026159U JPS6234456Y2 (enrdf_load_stackoverflow) 1980-03-03 1980-03-03

Publications (2)

Publication Number Publication Date
JPS56129759U true JPS56129759U (enrdf_load_stackoverflow) 1981-10-02
JPS6234456Y2 JPS6234456Y2 (enrdf_load_stackoverflow) 1987-09-02

Family

ID=29622165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980026159U Expired JPS6234456Y2 (enrdf_load_stackoverflow) 1980-03-03 1980-03-03

Country Status (1)

Country Link
JP (1) JPS6234456Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014196263A1 (ja) * 2013-06-07 2014-12-11 株式会社村田製作所 光部品、光プラグ、光コネクタ及び光部品の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5394193A (en) * 1977-01-27 1978-08-17 Electric Power Res Inst Optical electronic semiconductor unit
JPS5621465U (enrdf_load_stackoverflow) * 1979-07-25 1981-02-25

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5394193A (en) * 1977-01-27 1978-08-17 Electric Power Res Inst Optical electronic semiconductor unit
JPS5621465U (enrdf_load_stackoverflow) * 1979-07-25 1981-02-25

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014196263A1 (ja) * 2013-06-07 2014-12-11 株式会社村田製作所 光部品、光プラグ、光コネクタ及び光部品の製造方法
JP5892292B2 (ja) * 2013-06-07 2016-03-23 株式会社村田製作所 光プラグ及び光コネクタ

Also Published As

Publication number Publication date
JPS6234456Y2 (enrdf_load_stackoverflow) 1987-09-02

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