JPS5612758A - Equipping of heat sink - Google Patents
Equipping of heat sinkInfo
- Publication number
- JPS5612758A JPS5612758A JP8798179A JP8798179A JPS5612758A JP S5612758 A JPS5612758 A JP S5612758A JP 8798179 A JP8798179 A JP 8798179A JP 8798179 A JP8798179 A JP 8798179A JP S5612758 A JPS5612758 A JP S5612758A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- screwed
- sub heat
- transistors
- equipping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
PURPOSE:To prevent the application of stress to transistors by the equipment of heat sink by a method wherein after a printed plate is screwed to a sub heat sink, transistors are screwed to the sub heat sink and the sub heat sink is screwed to a main heat sink. CONSTITUTION:A projection 18 is exposed through an opening 16, and a printed plate 13 and a sub heat sink 17 are screwed with screws 20 utilizing the equipping part 16. Then transistors 14 are screwed to a projection 18 of a sub heat sink 17 being exposed through the opening 16 with screws 21. By this way, the printed plate 13 and the sub heat sink 17 containing the transistors 14 are made in one unit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8798179A JPS5612758A (en) | 1979-07-11 | 1979-07-11 | Equipping of heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8798179A JPS5612758A (en) | 1979-07-11 | 1979-07-11 | Equipping of heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5612758A true JPS5612758A (en) | 1981-02-07 |
Family
ID=13929993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8798179A Pending JPS5612758A (en) | 1979-07-11 | 1979-07-11 | Equipping of heat sink |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5612758A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63104798U (en) * | 1986-12-26 | 1988-07-07 |
-
1979
- 1979-07-11 JP JP8798179A patent/JPS5612758A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63104798U (en) * | 1986-12-26 | 1988-07-07 | ||
JPH0326389Y2 (en) * | 1986-12-26 | 1991-06-07 |
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