JPS56126863U - - Google Patents

Info

Publication number
JPS56126863U
JPS56126863U JP1980023978U JP2397880U JPS56126863U JP S56126863 U JPS56126863 U JP S56126863U JP 1980023978 U JP1980023978 U JP 1980023978U JP 2397880 U JP2397880 U JP 2397880U JP S56126863 U JPS56126863 U JP S56126863U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980023978U
Other languages
Japanese (ja)
Other versions
JPS626694Y2 (ja�@�@
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980023978U priority Critical patent/JPS626694Y2/ja
Publication of JPS56126863U publication Critical patent/JPS56126863U/ja
Application granted granted Critical
Publication of JPS626694Y2 publication Critical patent/JPS626694Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1980023978U 1980-02-26 1980-02-26 Expired JPS626694Y2 (ja�@�@)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980023978U JPS626694Y2 (ja�@�@) 1980-02-26 1980-02-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980023978U JPS626694Y2 (ja�@�@) 1980-02-26 1980-02-26

Publications (2)

Publication Number Publication Date
JPS56126863U true JPS56126863U (ja�@�@) 1981-09-26
JPS626694Y2 JPS626694Y2 (ja�@�@) 1987-02-16

Family

ID=29620072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980023978U Expired JPS626694Y2 (ja�@�@) 1980-02-26 1980-02-26

Country Status (1)

Country Link
JP (1) JPS626694Y2 (ja�@�@)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5471571A (en) * 1977-11-17 1979-06-08 Nec Corp Semiconductor device and production of the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5471571A (en) * 1977-11-17 1979-06-08 Nec Corp Semiconductor device and production of the same

Also Published As

Publication number Publication date
JPS626694Y2 (ja�@�@) 1987-02-16

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