JPS56126863U - - Google Patents

Info

Publication number
JPS56126863U
JPS56126863U JP2397880U JP2397880U JPS56126863U JP S56126863 U JPS56126863 U JP S56126863U JP 2397880 U JP2397880 U JP 2397880U JP 2397880 U JP2397880 U JP 2397880U JP S56126863 U JPS56126863 U JP S56126863U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2397880U
Other languages
Japanese (ja)
Other versions
JPS626694Y2 (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980023978U priority Critical patent/JPS626694Y2/ja
Publication of JPS56126863U publication Critical patent/JPS56126863U/ja
Application granted granted Critical
Publication of JPS626694Y2 publication Critical patent/JPS626694Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1980023978U 1980-02-26 1980-02-26 Expired JPS626694Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980023978U JPS626694Y2 (cs) 1980-02-26 1980-02-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980023978U JPS626694Y2 (cs) 1980-02-26 1980-02-26

Publications (2)

Publication Number Publication Date
JPS56126863U true JPS56126863U (cs) 1981-09-26
JPS626694Y2 JPS626694Y2 (cs) 1987-02-16

Family

ID=29620072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980023978U Expired JPS626694Y2 (cs) 1980-02-26 1980-02-26

Country Status (1)

Country Link
JP (1) JPS626694Y2 (cs)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5471571A (en) * 1977-11-17 1979-06-08 Nec Corp Semiconductor device and production of the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5471571A (en) * 1977-11-17 1979-06-08 Nec Corp Semiconductor device and production of the same

Also Published As

Publication number Publication date
JPS626694Y2 (cs) 1987-02-16

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