JPS56110220A - Method of manufacturing porcelain laminated layer zone - Google Patents
Method of manufacturing porcelain laminated layer zoneInfo
- Publication number
- JPS56110220A JPS56110220A JP1319180A JP1319180A JPS56110220A JP S56110220 A JPS56110220 A JP S56110220A JP 1319180 A JP1319180 A JP 1319180A JP 1319180 A JP1319180 A JP 1319180A JP S56110220 A JPS56110220 A JP S56110220A
- Authority
- JP
- Japan
- Prior art keywords
- laminated layer
- layer zone
- manufacturing porcelain
- porcelain laminated
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1319180A JPS56110220A (en) | 1980-02-05 | 1980-02-05 | Method of manufacturing porcelain laminated layer zone |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1319180A JPS56110220A (en) | 1980-02-05 | 1980-02-05 | Method of manufacturing porcelain laminated layer zone |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56110220A true JPS56110220A (en) | 1981-09-01 |
JPS6333289B2 JPS6333289B2 (ja) | 1988-07-05 |
Family
ID=11826267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1319180A Granted JPS56110220A (en) | 1980-02-05 | 1980-02-05 | Method of manufacturing porcelain laminated layer zone |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56110220A (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58114031U (ja) * | 1982-01-27 | 1983-08-04 | 日本電気ホームエレクトロニクス株式会社 | 誘電体シ−ト |
JP2006203165A (ja) * | 2005-01-20 | 2006-08-03 | Samsung Electro Mech Co Ltd | 積層型チップキャパシタ |
JP2007173626A (ja) * | 2005-12-22 | 2007-07-05 | Ngk Spark Plug Co Ltd | コンデンサの製造方法及びコンデンサ |
US8304321B2 (en) | 2005-12-22 | 2012-11-06 | Ngk Spark Plug Co., Ltd. | Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate |
JP2013251522A (ja) * | 2012-05-30 | 2013-12-12 | Samsung Electro-Mechanics Co Ltd | 積層チップ電子部品、その実装基板及び包装体 |
JP2014033097A (ja) * | 2012-08-03 | 2014-02-20 | Tdk Corp | 積層セラミックコンデンサ |
JP2014096555A (ja) * | 2012-11-09 | 2014-05-22 | Samsung Electro-Mechanics Co Ltd | 積層セラミックキャパシタ、積層セラミックキャパシタの回路基板実装構造及び積層セラミックキャパシタの包装体 |
JP2014203994A (ja) * | 2013-04-05 | 2014-10-27 | 株式会社村田製作所 | 積層コンデンサ、テーピング積層コンデンサ連及び積層コンデンサの実装構造体 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03117993U (ja) * | 1990-03-19 | 1991-12-05 |
-
1980
- 1980-02-05 JP JP1319180A patent/JPS56110220A/ja active Granted
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58114031U (ja) * | 1982-01-27 | 1983-08-04 | 日本電気ホームエレクトロニクス株式会社 | 誘電体シ−ト |
JP2006203165A (ja) * | 2005-01-20 | 2006-08-03 | Samsung Electro Mech Co Ltd | 積層型チップキャパシタ |
JP2007173626A (ja) * | 2005-12-22 | 2007-07-05 | Ngk Spark Plug Co Ltd | コンデンサの製造方法及びコンデンサ |
US8304321B2 (en) | 2005-12-22 | 2012-11-06 | Ngk Spark Plug Co., Ltd. | Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate |
US8350306B2 (en) | 2005-12-22 | 2013-01-08 | Ngk Spark Plug Co., Ltd. | Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate |
US8697534B2 (en) | 2005-12-22 | 2014-04-15 | Ngk Spark Plug Co., Ltd. | Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate |
JP2013251522A (ja) * | 2012-05-30 | 2013-12-12 | Samsung Electro-Mechanics Co Ltd | 積層チップ電子部品、その実装基板及び包装体 |
JP2014033097A (ja) * | 2012-08-03 | 2014-02-20 | Tdk Corp | 積層セラミックコンデンサ |
JP2014096555A (ja) * | 2012-11-09 | 2014-05-22 | Samsung Electro-Mechanics Co Ltd | 積層セラミックキャパシタ、積層セラミックキャパシタの回路基板実装構造及び積層セラミックキャパシタの包装体 |
JP2014203994A (ja) * | 2013-04-05 | 2014-10-27 | 株式会社村田製作所 | 積層コンデンサ、テーピング積層コンデンサ連及び積層コンデンサの実装構造体 |
Also Published As
Publication number | Publication date |
---|---|
JPS6333289B2 (ja) | 1988-07-05 |
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