JPS56108875A - Power supply apparatus for spattering apparatus - Google Patents
Power supply apparatus for spattering apparatusInfo
- Publication number
- JPS56108875A JPS56108875A JP12424679A JP12424679A JPS56108875A JP S56108875 A JPS56108875 A JP S56108875A JP 12424679 A JP12424679 A JP 12424679A JP 12424679 A JP12424679 A JP 12424679A JP S56108875 A JPS56108875 A JP S56108875A
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- spattering
- supply apparatus
- spattering apparatus
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
- H01J37/3277—Continuous moving of continuous material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3444—Associated circuits
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Plasma Technology (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/066,917 US4284490A (en) | 1978-09-28 | 1979-08-21 | R.F. Sputtering apparatus including multi-network power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56108875A true JPS56108875A (en) | 1981-08-28 |
Family
ID=22072548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12424679A Pending JPS56108875A (en) | 1979-08-21 | 1979-09-28 | Power supply apparatus for spattering apparatus |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS56108875A (en) |
| CA (1) | CA1143005A (en) |
| DE (1) | DE2939167A1 (en) |
| FR (1) | FR2464009A1 (en) |
| GB (1) | GB2058470A (en) |
| NL (1) | NL7907241A (en) |
| SE (1) | SE7908083L (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61295370A (en) * | 1985-06-25 | 1986-12-26 | Shinku Kikai Kogyo Kk | Sputtering device |
| JPH02156081A (en) * | 1988-12-09 | 1990-06-15 | Tokuda Seisakusho Ltd | Sputtering device |
| JPH08319564A (en) * | 1988-01-11 | 1996-12-03 | Tadahiro Omi | Sputtering controller in thin film forming device |
| JP2008520091A (en) * | 2004-11-12 | 2008-06-12 | オー・ツェー・エリコン・バルザース・アクチェンゲゼルシャフト | Impedance matching of capacitively coupled RF plasma reactor suitable for large area substrates |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1129229C (en) * | 1997-09-17 | 2003-11-26 | 东京电子株式会社 | Electrical impedance matching system and method |
| DE10015699B4 (en) * | 2000-03-27 | 2004-03-18 | Forschungs- Und Applikationslabor Plasmatechnik Gmbh Dresden | Circuit arrangement for impedance compensation |
| DE202008006477U1 (en) * | 2008-05-06 | 2008-07-24 | Forschungs- Und Applikationslabor Plasmatechnik Gmbh Dresden | Device for modifying substrate surfaces |
-
1979
- 1979-09-27 DE DE19792939167 patent/DE2939167A1/en not_active Withdrawn
- 1979-09-28 NL NL7907241A patent/NL7907241A/en not_active Application Discontinuation
- 1979-09-28 GB GB7933758A patent/GB2058470A/en not_active Withdrawn
- 1979-09-28 JP JP12424679A patent/JPS56108875A/en active Pending
- 1979-09-28 SE SE7908083A patent/SE7908083L/en unknown
- 1979-09-28 CA CA000336679A patent/CA1143005A/en not_active Expired
- 1979-09-28 FR FR7924317A patent/FR2464009A1/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61295370A (en) * | 1985-06-25 | 1986-12-26 | Shinku Kikai Kogyo Kk | Sputtering device |
| JPH08319564A (en) * | 1988-01-11 | 1996-12-03 | Tadahiro Omi | Sputtering controller in thin film forming device |
| JPH02156081A (en) * | 1988-12-09 | 1990-06-15 | Tokuda Seisakusho Ltd | Sputtering device |
| JP2008520091A (en) * | 2004-11-12 | 2008-06-12 | オー・ツェー・エリコン・バルザース・アクチェンゲゼルシャフト | Impedance matching of capacitively coupled RF plasma reactor suitable for large area substrates |
Also Published As
| Publication number | Publication date |
|---|---|
| NL7907241A (en) | 1981-02-24 |
| SE7908083L (en) | 1981-02-22 |
| GB2058470A (en) | 1981-04-08 |
| CA1143005A (en) | 1983-03-15 |
| FR2464009A1 (en) | 1981-02-27 |
| DE2939167A1 (en) | 1981-04-02 |
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