JPS56106471U - - Google Patents
Info
- Publication number
- JPS56106471U JPS56106471U JP467080U JP467080U JPS56106471U JP S56106471 U JPS56106471 U JP S56106471U JP 467080 U JP467080 U JP 467080U JP 467080 U JP467080 U JP 467080U JP S56106471 U JPS56106471 U JP S56106471U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP467080U JPS56106471U (ru) | 1980-01-19 | 1980-01-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP467080U JPS56106471U (ru) | 1980-01-19 | 1980-01-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56106471U true JPS56106471U (ru) | 1981-08-19 |
Family
ID=29601349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP467080U Pending JPS56106471U (ru) | 1980-01-19 | 1980-01-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56106471U (ru) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5893395A (ja) * | 1981-11-30 | 1983-06-03 | 日本電気株式会社 | 接続方法 |
JPS58142917U (ja) * | 1982-03-23 | 1983-09-27 | ティーディーケイ株式会社 | 電子部品 |
WO2017090460A1 (ja) * | 2015-11-27 | 2017-06-01 | ソニー株式会社 | 基板装置、および基板装置の製造方法 |
-
1980
- 1980-01-19 JP JP467080U patent/JPS56106471U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5893395A (ja) * | 1981-11-30 | 1983-06-03 | 日本電気株式会社 | 接続方法 |
JPS58142917U (ja) * | 1982-03-23 | 1983-09-27 | ティーディーケイ株式会社 | 電子部品 |
WO2017090460A1 (ja) * | 2015-11-27 | 2017-06-01 | ソニー株式会社 | 基板装置、および基板装置の製造方法 |