JPS56100417U - - Google Patents
Info
- Publication number
- JPS56100417U JPS56100417U JP18538779U JP18538779U JPS56100417U JP S56100417 U JPS56100417 U JP S56100417U JP 18538779 U JP18538779 U JP 18538779U JP 18538779 U JP18538779 U JP 18538779U JP S56100417 U JPS56100417 U JP S56100417U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Threshing Machine Elements (AREA)
- Control Of Conveyors (AREA)
- Filling Or Emptying Of Bunkers, Hoppers, And Tanks (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18538779U JPS6333854Y2 (cs) | 1979-12-26 | 1979-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18538779U JPS6333854Y2 (cs) | 1979-12-26 | 1979-12-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56100417U true JPS56100417U (cs) | 1981-08-07 |
| JPS6333854Y2 JPS6333854Y2 (cs) | 1988-09-08 |
Family
ID=29695574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18538779U Expired JPS6333854Y2 (cs) | 1979-12-26 | 1979-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6333854Y2 (cs) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000164788A (ja) | 1998-11-20 | 2000-06-16 | Anam Semiconductor Inc | 半導体パッケ―ジ用リ―ドフレ―ムとこれを用いた半導体パッケ―ジ及びその製造方法 |
| US6905914B1 (en) | 2002-11-08 | 2005-06-14 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US7361533B1 (en) | 2002-11-08 | 2008-04-22 | Amkor Technology, Inc. | Stacked embedded leadframe |
| US7572681B1 (en) | 2005-12-08 | 2009-08-11 | Amkor Technology, Inc. | Embedded electronic component package |
| US8937381B1 (en) | 2009-12-03 | 2015-01-20 | Amkor Technology, Inc. | Thin stackable package and method |
| US8324511B1 (en) | 2010-04-06 | 2012-12-04 | Amkor Technology, Inc. | Through via nub reveal method and structure |
| US8440554B1 (en) | 2010-08-02 | 2013-05-14 | Amkor Technology, Inc. | Through via connected backside embedded circuit features structure and method |
| US8487445B1 (en) | 2010-10-05 | 2013-07-16 | Amkor Technology, Inc. | Semiconductor device having through electrodes protruding from dielectric layer |
| US8552548B1 (en) | 2011-11-29 | 2013-10-08 | Amkor Technology, Inc. | Conductive pad on protruding through electrode semiconductor device |
-
1979
- 1979-12-26 JP JP18538779U patent/JPS6333854Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6333854Y2 (cs) | 1988-09-08 |