JPS559501U - - Google Patents
Info
- Publication number
- JPS559501U JPS559501U JP8914778U JP8914778U JPS559501U JP S559501 U JPS559501 U JP S559501U JP 8914778 U JP8914778 U JP 8914778U JP 8914778 U JP8914778 U JP 8914778U JP S559501 U JPS559501 U JP S559501U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8914778U JPS559501U (en) | 1978-06-30 | 1978-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8914778U JPS559501U (en) | 1978-06-30 | 1978-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS559501U true JPS559501U (en) | 1980-01-22 |
Family
ID=29016275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8914778U Pending JPS559501U (en) | 1978-06-30 | 1978-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS559501U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3128190A1 (en) * | 1980-07-18 | 1982-04-08 | Canon K.K., Tokyo | "LASER SEMICONDUCTOR DEVICE" |
| JPH01305587A (en) * | 1988-06-03 | 1989-12-08 | Ricoh Co Ltd | Semiconductor laser beam source |
-
1978
- 1978-06-30 JP JP8914778U patent/JPS559501U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3128190A1 (en) * | 1980-07-18 | 1982-04-08 | Canon K.K., Tokyo | "LASER SEMICONDUCTOR DEVICE" |
| JPH01305587A (en) * | 1988-06-03 | 1989-12-08 | Ricoh Co Ltd | Semiconductor laser beam source |