JPS559442B2 - - Google Patents
Info
- Publication number
- JPS559442B2 JPS559442B2 JP1857772A JP1857772A JPS559442B2 JP S559442 B2 JPS559442 B2 JP S559442B2 JP 1857772 A JP1857772 A JP 1857772A JP 1857772 A JP1857772 A JP 1857772A JP S559442 B2 JPS559442 B2 JP S559442B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Refinement Of Pig-Iron, Manufacture Of Cast Iron, And Steel Manufacture Other Than In Revolving Furnaces (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1857772A JPS559442B2 (xx) | 1972-02-24 | 1972-02-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1857772A JPS559442B2 (xx) | 1972-02-24 | 1972-02-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS4894613A JPS4894613A (xx) | 1973-12-05 |
JPS559442B2 true JPS559442B2 (xx) | 1980-03-10 |
Family
ID=11975464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1857772A Expired JPS559442B2 (xx) | 1972-02-24 | 1972-02-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS559442B2 (xx) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH055515Y2 (xx) * | 1986-07-29 | 1993-02-12 | ||
WO2003010833A2 (en) | 2001-07-23 | 2003-02-06 | Cree, Inc. | Flip chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding |
-
1972
- 1972-02-24 JP JP1857772A patent/JPS559442B2/ja not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH055515Y2 (xx) * | 1986-07-29 | 1993-02-12 | ||
WO2003010833A2 (en) | 2001-07-23 | 2003-02-06 | Cree, Inc. | Flip chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding |
Also Published As
Publication number | Publication date |
---|---|
JPS4894613A (xx) | 1973-12-05 |