JPS5592293A - Solid flux for soldering - Google Patents

Solid flux for soldering

Info

Publication number
JPS5592293A
JPS5592293A JP16430678A JP16430678A JPS5592293A JP S5592293 A JPS5592293 A JP S5592293A JP 16430678 A JP16430678 A JP 16430678A JP 16430678 A JP16430678 A JP 16430678A JP S5592293 A JPS5592293 A JP S5592293A
Authority
JP
Japan
Prior art keywords
soldering
solid
parts
flux
solid flux
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16430678A
Other languages
Japanese (ja)
Other versions
JPS6219277B2 (en
Inventor
Katsuhiko Aoyama
Yoshiji Matsuzawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SANWA KAGAKU KOGYO KK
Original Assignee
SANWA KAGAKU KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SANWA KAGAKU KOGYO KK filed Critical SANWA KAGAKU KOGYO KK
Priority to JP16430678A priority Critical patent/JPS5592293A/en
Publication of JPS5592293A publication Critical patent/JPS5592293A/en
Publication of JPS6219277B2 publication Critical patent/JPS6219277B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:The solid flux which is capable of fixing the legs of the parts to be mounted to the extent of permitting cutting of their lead wires prior to soldering, and enables the saving of the labor for preliminary soldering and the reduction in damaging of cutters. CONSTITUTION:This solid flux comprises using petroleum-base or animal and vegetable oil base waxes as base and adding organic acids having carboxyl groups (e.g.: saturated or unsaturated fatty acids) and antioxidants and is obtained by heating and dissolving these. This flux is solid and therefore if this is coated on printed wiring boards by a dipping method, the legs of the parts to be mounted to the wiring boards may be fixed to the extent of permitting cutting of the lead wires of the parts without preliminary soldering. This solid flux sufficiently melts at temperature around 200 deg.C for soldering, hence it shows good solderability and gives finishes of good appearance.
JP16430678A 1978-12-28 1978-12-28 Solid flux for soldering Granted JPS5592293A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16430678A JPS5592293A (en) 1978-12-28 1978-12-28 Solid flux for soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16430678A JPS5592293A (en) 1978-12-28 1978-12-28 Solid flux for soldering

Publications (2)

Publication Number Publication Date
JPS5592293A true JPS5592293A (en) 1980-07-12
JPS6219277B2 JPS6219277B2 (en) 1987-04-27

Family

ID=15790613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16430678A Granted JPS5592293A (en) 1978-12-28 1978-12-28 Solid flux for soldering

Country Status (1)

Country Link
JP (1) JPS5592293A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60133998A (en) * 1983-12-22 1985-07-17 Nippon Genma:Kk Flux for soldering
JPS6234696A (en) * 1985-08-08 1987-02-14 Uchihashi Kinzoku Kogyo Kk Flux
JPH06509080A (en) * 1991-07-11 1994-10-13 ファイザー・インコーポレーテッド How to make sertraline
JPH0822473B2 (en) * 1989-04-11 1996-03-06 ヒューズ・エアクラフト・カンパニー Method for protecting metal surface and facilitating soldering, and film and solution used therein

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5392468A (en) * 1977-01-25 1978-08-14 Kondo Kenji Method of soldering printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5392468A (en) * 1977-01-25 1978-08-14 Kondo Kenji Method of soldering printed circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60133998A (en) * 1983-12-22 1985-07-17 Nippon Genma:Kk Flux for soldering
JPH0453634B2 (en) * 1983-12-22 1992-08-27 Nippon Genma Kk
JPS6234696A (en) * 1985-08-08 1987-02-14 Uchihashi Kinzoku Kogyo Kk Flux
JPH0822473B2 (en) * 1989-04-11 1996-03-06 ヒューズ・エアクラフト・カンパニー Method for protecting metal surface and facilitating soldering, and film and solution used therein
JPH06509080A (en) * 1991-07-11 1994-10-13 ファイザー・インコーポレーテッド How to make sertraline
JP2566374B2 (en) * 1991-07-11 1996-12-25 ファイザー・インコーポレーテッド Method for producing sertraline

Also Published As

Publication number Publication date
JPS6219277B2 (en) 1987-04-27

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