JPS5591866U - - Google Patents
Info
- Publication number
- JPS5591866U JPS5591866U JP17416678U JP17416678U JPS5591866U JP S5591866 U JPS5591866 U JP S5591866U JP 17416678 U JP17416678 U JP 17416678U JP 17416678 U JP17416678 U JP 17416678U JP S5591866 U JPS5591866 U JP S5591866U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17416678U JPS5591866U (en) | 1978-12-16 | 1978-12-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17416678U JPS5591866U (en) | 1978-12-16 | 1978-12-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5591866U true JPS5591866U (en) | 1980-06-25 |
Family
ID=29180524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17416678U Pending JPS5591866U (en) | 1978-12-16 | 1978-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5591866U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009275276A (en) * | 2008-05-16 | 2009-11-26 | Tokyo Ohka Kogyo Co Ltd | Three-dimensional structure having conductive layer and manufacturing method of three-dimensional metal structure |
| WO2013072954A1 (en) * | 2011-11-15 | 2013-05-23 | 株式会社Ｌｅａｐ | Production method for transfer mold, transfer mold produced using same, and component produced using said transfer mold |
| JP2013104130A (en) * | 2012-07-26 | 2013-05-30 | Leap Co Ltd | Method for manufacturing transfer mold, transfer mold manufactured by the same, and component produced by using the transfer mold |
-
1978
- 1978-12-16 JP JP17416678U patent/JPS5591866U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009275276A (en) * | 2008-05-16 | 2009-11-26 | Tokyo Ohka Kogyo Co Ltd | Three-dimensional structure having conductive layer and manufacturing method of three-dimensional metal structure |
| WO2013072954A1 (en) * | 2011-11-15 | 2013-05-23 | 株式会社Ｌｅａｐ | Production method for transfer mold, transfer mold produced using same, and component produced using said transfer mold |
| EP2781626A4 (en) * | 2011-11-15 | 2015-06-24 | Leap Co Ltd | Production method for transfer mold, transfer mold produced using same, and component produced using said transfer mold |
| JP2013104130A (en) * | 2012-07-26 | 2013-05-30 | Leap Co Ltd | Method for manufacturing transfer mold, transfer mold manufactured by the same, and component produced by using the transfer mold |