JPS5591151U - - Google Patents
Info
- Publication number
- JPS5591151U JPS5591151U JP17450878U JP17450878U JPS5591151U JP S5591151 U JPS5591151 U JP S5591151U JP 17450878 U JP17450878 U JP 17450878U JP 17450878 U JP17450878 U JP 17450878U JP S5591151 U JPS5591151 U JP S5591151U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17450878U JPS5591151U (fr) | 1978-12-19 | 1978-12-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17450878U JPS5591151U (fr) | 1978-12-19 | 1978-12-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5591151U true JPS5591151U (fr) | 1980-06-24 |
Family
ID=29181193
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17450878U Pending JPS5591151U (fr) | 1978-12-19 | 1978-12-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5591151U (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02110944A (ja) * | 1988-10-19 | 1990-04-24 | Toshiba Corp | 圧接型半導体装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50152664A (fr) * | 1974-05-27 | 1975-12-08 | ||
JPS5732359U (fr) * | 1980-07-31 | 1982-02-20 |
-
1978
- 1978-12-19 JP JP17450878U patent/JPS5591151U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50152664A (fr) * | 1974-05-27 | 1975-12-08 | ||
JPS5732359U (fr) * | 1980-07-31 | 1982-02-20 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02110944A (ja) * | 1988-10-19 | 1990-04-24 | Toshiba Corp | 圧接型半導体装置 |