JPS5590262A - Method of manufacturing polisher - Google Patents

Method of manufacturing polisher

Info

Publication number
JPS5590262A
JPS5590262A JP15917178A JP15917178A JPS5590262A JP S5590262 A JPS5590262 A JP S5590262A JP 15917178 A JP15917178 A JP 15917178A JP 15917178 A JP15917178 A JP 15917178A JP S5590262 A JPS5590262 A JP S5590262A
Authority
JP
Japan
Prior art keywords
polisher
resin
projections
recesses
synthetic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15917178A
Other languages
Japanese (ja)
Inventor
Toshiro Karaki
Yuji Hiraoka
Kiyoshi Sawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP15917178A priority Critical patent/JPS5590262A/en
Publication of JPS5590262A publication Critical patent/JPS5590262A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To cheaply and efficiently manufacture a heavy polisher of uniform surface construction, by setting a thermoplastic synthetic resin for the polisher between dies and heating and shaping the resin to provide recesses and projections. CONSTITUTION:A load is applied to a thermoplastic synthetic resin 1 and a pattern mask 3 by the thrusting action of press boards 4 for a prescribed time. The resin and the mask are then cooled in air and in a liquid. As a result, recesses and projections in a shape corresponding to that of recesses and projections 2 of the pattern mask 3 are provided on the surface of the synthetic resin 1. The shaped resin 1 is picked out. A heavy polisher is thus obtained.
JP15917178A 1978-12-26 1978-12-26 Method of manufacturing polisher Pending JPS5590262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15917178A JPS5590262A (en) 1978-12-26 1978-12-26 Method of manufacturing polisher

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15917178A JPS5590262A (en) 1978-12-26 1978-12-26 Method of manufacturing polisher

Publications (1)

Publication Number Publication Date
JPS5590262A true JPS5590262A (en) 1980-07-08

Family

ID=15687828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15917178A Pending JPS5590262A (en) 1978-12-26 1978-12-26 Method of manufacturing polisher

Country Status (1)

Country Link
JP (1) JPS5590262A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5978054U (en) * 1982-11-18 1984-05-26 アルプス電気株式会社 polishing equipment
JPS61199354U (en) * 1985-05-30 1986-12-13
WO2006020153A3 (en) * 2004-07-21 2006-04-27 Neopad Technologies Corp Methods for producing in-situ grooves in chemical mechanical planarization (cmp) pads, and novel cmp pad designs

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5978054U (en) * 1982-11-18 1984-05-26 アルプス電気株式会社 polishing equipment
JPS6212536Y2 (en) * 1982-11-18 1987-04-01
JPS61199354U (en) * 1985-05-30 1986-12-13
WO2006020153A3 (en) * 2004-07-21 2006-04-27 Neopad Technologies Corp Methods for producing in-situ grooves in chemical mechanical planarization (cmp) pads, and novel cmp pad designs
US7377840B2 (en) 2004-07-21 2008-05-27 Neopad Technologies Corporation Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs
US8287793B2 (en) 2004-07-21 2012-10-16 Nexplanar Corporation Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs
US8932116B2 (en) 2004-07-21 2015-01-13 Nexplanar Corporation Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs

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