JPS558835B2 - - Google Patents
Info
- Publication number
- JPS558835B2 JPS558835B2 JP10722172A JP10722172A JPS558835B2 JP S558835 B2 JPS558835 B2 JP S558835B2 JP 10722172 A JP10722172 A JP 10722172A JP 10722172 A JP10722172 A JP 10722172A JP S558835 B2 JPS558835 B2 JP S558835B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Coils Or Transformers For Communication (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10722172A JPS558835B2 (en:Method) | 1972-10-27 | 1972-10-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10722172A JPS558835B2 (en:Method) | 1972-10-27 | 1972-10-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4963964A JPS4963964A (en:Method) | 1974-06-20 |
| JPS558835B2 true JPS558835B2 (en:Method) | 1980-03-06 |
Family
ID=14453547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10722172A Expired JPS558835B2 (en:Method) | 1972-10-27 | 1972-10-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS558835B2 (en:Method) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5615098A (en) * | 1979-07-18 | 1981-02-13 | Ngk Spark Plug Co | Low dielectric multilayer ceramic substrate |
| JP2712496B2 (ja) * | 1989-03-02 | 1998-02-10 | 松下電器産業株式会社 | セラミック多層配線基板の製造方法 |
| JP2794879B2 (ja) * | 1990-02-20 | 1998-09-10 | 松下電器産業株式会社 | 多層基板 |
| JPH0653652A (ja) * | 1991-03-14 | 1994-02-25 | Nec Corp | 多層セラミック配線基板とその製造方法 |
| JP3675688B2 (ja) * | 2000-01-27 | 2005-07-27 | 寛治 大塚 | 配線基板及びその製造方法 |
| JP2002151854A (ja) * | 2000-11-15 | 2002-05-24 | Genesis Technology Kk | 多層プリント配線板およびその製造方法 |
| JP7184031B2 (ja) * | 2019-12-27 | 2022-12-06 | 株式会社村田製作所 | 積層コイル部品 |
-
1972
- 1972-10-27 JP JP10722172A patent/JPS558835B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4963964A (en:Method) | 1974-06-20 |