JPS558277Y2 - - Google Patents

Info

Publication number
JPS558277Y2
JPS558277Y2 JP1972110676U JP11067672U JPS558277Y2 JP S558277 Y2 JPS558277 Y2 JP S558277Y2 JP 1972110676 U JP1972110676 U JP 1972110676U JP 11067672 U JP11067672 U JP 11067672U JP S558277 Y2 JPS558277 Y2 JP S558277Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1972110676U
Other languages
Japanese (ja)
Other versions
JPS4966359U (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1972110676U priority Critical patent/JPS558277Y2/ja
Publication of JPS4966359U publication Critical patent/JPS4966359U/ja
Application granted granted Critical
Publication of JPS558277Y2 publication Critical patent/JPS558277Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1972110676U 1972-09-21 1972-09-21 Expired JPS558277Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1972110676U JPS558277Y2 (cs) 1972-09-21 1972-09-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972110676U JPS558277Y2 (cs) 1972-09-21 1972-09-21

Publications (2)

Publication Number Publication Date
JPS4966359U JPS4966359U (cs) 1974-06-10
JPS558277Y2 true JPS558277Y2 (cs) 1980-02-23

Family

ID=28334339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1972110676U Expired JPS558277Y2 (cs) 1972-09-21 1972-09-21

Country Status (1)

Country Link
JP (1) JPS558277Y2 (cs)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4420119Y1 (cs) * 1966-02-18 1969-08-28

Also Published As

Publication number Publication date
JPS4966359U (cs) 1974-06-10

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