JPS558264Y2 - - Google Patents
Info
- Publication number
- JPS558264Y2 JPS558264Y2 JP1974094695U JP9469574U JPS558264Y2 JP S558264 Y2 JPS558264 Y2 JP S558264Y2 JP 1974094695 U JP1974094695 U JP 1974094695U JP 9469574 U JP9469574 U JP 9469574U JP S558264 Y2 JPS558264 Y2 JP S558264Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974094695U JPS558264Y2 (ja) | 1974-08-08 | 1974-08-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974094695U JPS558264Y2 (ja) | 1974-08-08 | 1974-08-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5123461U JPS5123461U (ja) | 1976-02-20 |
| JPS558264Y2 true JPS558264Y2 (ja) | 1980-02-23 |
Family
ID=28289388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1974094695U Expired JPS558264Y2 (ja) | 1974-08-08 | 1974-08-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS558264Y2 (ja) |
-
1974
- 1974-08-08 JP JP1974094695U patent/JPS558264Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5123461U (ja) | 1976-02-20 |