JPS5573340U - - Google Patents
Info
- Publication number
- JPS5573340U JPS5573340U JP1979143367U JP14336779U JPS5573340U JP S5573340 U JPS5573340 U JP S5573340U JP 1979143367 U JP1979143367 U JP 1979143367U JP 14336779 U JP14336779 U JP 14336779U JP S5573340 U JPS5573340 U JP S5573340U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10807—Making laminated safety glass or glazing; Apparatus therefor
- B32B17/10899—Making laminated safety glass or glazing; Apparatus therefor by introducing interlayers of synthetic resin
- B32B17/10954—Making laminated safety glass or glazing; Apparatus therefor by introducing interlayers of synthetic resin by using an aligning laminating device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
- B23K37/0426—Fixtures for other work
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1744—Means bringing discrete articles into assembled relationship
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49895—Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/952,912 US4220491A (en) | 1978-10-19 | 1978-10-19 | Method for forming an accurately assembled laminate utilizing a vacuum holding press |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5573340U true JPS5573340U (enExample) | 1980-05-20 |
| JPS5710832Y2 JPS5710832Y2 (enExample) | 1982-03-03 |
Family
ID=25493340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979143367U Expired JPS5710832Y2 (enExample) | 1978-10-19 | 1979-10-18 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4220491A (enExample) |
| JP (1) | JPS5710832Y2 (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4314866A (en) * | 1980-12-09 | 1982-02-09 | Lockheed Corporation | Method for elevated-temperature bonding of material with different coefficients of thermal expansion |
| US4640734A (en) * | 1984-05-24 | 1987-02-03 | Atlantic Richfield Company | Method and apparatus for assembling large panels |
| IT1179827B (it) * | 1984-11-23 | 1987-09-16 | Aeritalia Spa | Procedimento e gruppo per il montaggio di un campo di specchi del tipo ssm (second surface mirror) su un pannello di un veicolo spaziale |
| EP0186143A3 (de) * | 1984-12-28 | 1987-04-15 | HEINRICH BRANDT MASCHINENBAU GmbH | Vorrichtung zum Aufbringen von Deckfolienmaterial auf plattenförmige Werkstücke oder dergleichen |
| US4878985A (en) * | 1987-03-20 | 1989-11-07 | Xerox Corporation | Apparatus for preparing belts |
| US4838964A (en) * | 1987-03-20 | 1989-06-13 | Xerox Corporation | Process for preparing belts |
| US4968369A (en) * | 1988-10-03 | 1990-11-06 | Xerox Corporation | Belt fabrication machine |
| EP0492469B1 (en) * | 1990-12-20 | 1995-08-30 | Canon Kabushiki Kaisha | A sheet sticker |
| US5473406A (en) * | 1994-07-21 | 1995-12-05 | Eastman Kodak Company | Apparatus and methods for assembling depth image systems |
| US6210509B1 (en) * | 1995-07-13 | 2001-04-03 | 3M Innovative Properties Company | Method of sheet laminating |
| US5849141A (en) * | 1995-10-30 | 1998-12-15 | Kinematic Automation, Inc. | Method and apparatus for precision card lamination |
| US5932045A (en) * | 1997-06-02 | 1999-08-03 | Lucent Technologies Inc. | Method for fabricating a multilayer optical article |
| JP2001513452A (ja) * | 1997-08-06 | 2001-09-04 | ローデル ホールディングス インコーポレイテッド | 連続的に変化し得る平坦化及び研磨パッドシステム |
| US7610194B2 (en) | 2002-07-18 | 2009-10-27 | Tegic Communications, Inc. | Dynamic database reordering system |
| US7286115B2 (en) | 2000-05-26 | 2007-10-23 | Tegic Communications, Inc. | Directional input system with automatic correction |
| US6733623B2 (en) * | 2001-07-18 | 2004-05-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for adhering a flexible film to a ventilated platen without air entrapment |
| US6721076B2 (en) | 2001-08-03 | 2004-04-13 | Inphase Technologies, Inc. | System and method for reflective holographic storage with associated multiplexing techniques |
| US7112359B2 (en) | 2001-08-22 | 2006-09-26 | Inphase Technologies, Inc. | Method and apparatus for multilayer optical articles |
| US7001541B2 (en) * | 2001-09-14 | 2006-02-21 | Inphase Technologies, Inc. | Method for forming multiply patterned optical articles |
| US6825960B2 (en) * | 2002-01-15 | 2004-11-30 | Inphase Technologies, Inc. | System and method for bitwise readout holographic ROM |
| US20070082179A1 (en) * | 2005-10-07 | 2007-04-12 | Wade James J | Method and apparatus for forming optical articles |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2969299A (en) * | 1958-07-21 | 1961-01-24 | Ryan Aeronautical Co | Method of handling thin-sheet material to prevent distortion |
| US3299502A (en) * | 1964-10-01 | 1967-01-24 | Western Electric Co | Methods and apparatus for assembling articles |
| US3453957A (en) * | 1966-10-31 | 1969-07-08 | Mc Donnell Douglas Corp | Apparatus for producing filter element |
| US3711081A (en) * | 1970-03-31 | 1973-01-16 | Ibm | Semiconductor wafer chuck |
| US3741116A (en) * | 1970-06-25 | 1973-06-26 | American Screen Process Equip | Vacuum belt |
| US3982979A (en) * | 1973-06-28 | 1976-09-28 | Western Electric Company, Inc. | Methods for mounting an article on an adherent site on a substrate |
| US3897294A (en) * | 1974-05-06 | 1975-07-29 | Gen Dynamics Corp | Method of forming a parabolic antenna |
| JPS5817011B2 (ja) * | 1974-09-12 | 1983-04-04 | 三菱化学株式会社 | ヨウチヤクソウチ |
| US4006909A (en) * | 1975-04-16 | 1977-02-08 | Rca Corporation | Semiconductor wafer chuck with built-in standoff for contactless photolithography |
| US3957371A (en) * | 1975-07-02 | 1976-05-18 | Honeywell Information Systems, Inc. | Locator pin for aligning printed circuit board with artwork |
-
1978
- 1978-10-19 US US05/952,912 patent/US4220491A/en not_active Expired - Lifetime
-
1979
- 1979-10-18 JP JP1979143367U patent/JPS5710832Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5710832Y2 (enExample) | 1982-03-03 |
| US4220491A (en) | 1980-09-02 |