JPS557323U - - Google Patents
Info
- Publication number
- JPS557323U JPS557323U JP1978088702U JP8870278U JPS557323U JP S557323 U JPS557323 U JP S557323U JP 1978088702 U JP1978088702 U JP 1978088702U JP 8870278 U JP8870278 U JP 8870278U JP S557323 U JPS557323 U JP S557323U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
-
- H10W72/01308—
-
- H10W72/07311—
-
- H10W72/07551—
-
- H10W72/387—
-
- H10W72/50—
-
- H10W72/5449—
-
- H10W72/884—
-
- H10W72/931—
-
- H10W74/00—
-
- H10W90/736—
-
- H10W90/756—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978088702U JPS557323U (enExample) | 1978-06-27 | 1978-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978088702U JPS557323U (enExample) | 1978-06-27 | 1978-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS557323U true JPS557323U (enExample) | 1980-01-18 |
Family
ID=29015426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978088702U Pending JPS557323U (enExample) | 1978-06-27 | 1978-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS557323U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013160989A1 (ja) * | 2012-04-23 | 2013-10-31 | 株式会社日立製作所 | ひずみセンサチップ実装構造体、ひずみセンサチップおよびひずみセンサチップ実装構造体の製造方法 |
| EP2796830A4 (en) * | 2011-12-06 | 2015-08-19 | Hitachi Ltd | Dynamic quantity measuring device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5132358U (enExample) * | 1974-08-30 | 1976-03-09 |
-
1978
- 1978-06-27 JP JP1978088702U patent/JPS557323U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5132358U (enExample) * | 1974-08-30 | 1976-03-09 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2796830A4 (en) * | 2011-12-06 | 2015-08-19 | Hitachi Ltd | Dynamic quantity measuring device |
| US9581427B2 (en) | 2011-12-06 | 2017-02-28 | Hitachi, Ltd. | Mechanical quantity measuring device |
| WO2013160989A1 (ja) * | 2012-04-23 | 2013-10-31 | 株式会社日立製作所 | ひずみセンサチップ実装構造体、ひずみセンサチップおよびひずみセンサチップ実装構造体の製造方法 |
| JPWO2013160989A1 (ja) * | 2012-04-23 | 2015-12-21 | 株式会社日立製作所 | ひずみセンサチップ実装構造体、ひずみセンサチップおよびひずみセンサチップ実装構造体の製造方法 |