JPS557322U - - Google Patents
Info
- Publication number
- JPS557322U JPS557322U JP8870178U JP8870178U JPS557322U JP S557322 U JPS557322 U JP S557322U JP 8870178 U JP8870178 U JP 8870178U JP 8870178 U JP8870178 U JP 8870178U JP S557322 U JPS557322 U JP S557322U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8870178U JPS557322U (enrdf_load_stackoverflow) | 1978-06-27 | 1978-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8870178U JPS557322U (enrdf_load_stackoverflow) | 1978-06-27 | 1978-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS557322U true JPS557322U (enrdf_load_stackoverflow) | 1980-01-18 |
Family
ID=29015424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8870178U Pending JPS557322U (enrdf_load_stackoverflow) | 1978-06-27 | 1978-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS557322U (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0173327U (enrdf_load_stackoverflow) * | 1987-11-04 | 1989-05-17 | ||
| JP2020202313A (ja) * | 2019-06-11 | 2020-12-17 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
-
1978
- 1978-06-27 JP JP8870178U patent/JPS557322U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0173327U (enrdf_load_stackoverflow) * | 1987-11-04 | 1989-05-17 | ||
| JP2020202313A (ja) * | 2019-06-11 | 2020-12-17 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |