JPS556854A - Lead frame strength test method of semiconductor device - Google Patents
Lead frame strength test method of semiconductor deviceInfo
- Publication number
- JPS556854A JPS556854A JP7900778A JP7900778A JPS556854A JP S556854 A JPS556854 A JP S556854A JP 7900778 A JP7900778 A JP 7900778A JP 7900778 A JP7900778 A JP 7900778A JP S556854 A JPS556854 A JP S556854A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor device
- trembler
- test method
- vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE: To test strength simply and for a short time, by fixing one portion of a semiconductor device, by mounting the lead frames to a trembler of a vibration tester and by applying vibration to the lead frames from the trembler.
CONSTITUTION: Each lead frame 2a-1W2a-n superficially projected on a flank of one side of a semiconductor device 1 is each installed to a support base 4 for fixing, and each lead frame 2b-1W2b-n superficially projected on a flank of the other side is severally disposed to a trembler 5 of a vibration tester. Consequently, vibration with arbitrary frequency and amplitude generated from the trembler 5 is applied to each lead frame, and time untile the frames are cut is measured, thus testing the strength.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7900778A JPS556854A (en) | 1978-06-28 | 1978-06-28 | Lead frame strength test method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7900778A JPS556854A (en) | 1978-06-28 | 1978-06-28 | Lead frame strength test method of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS556854A true JPS556854A (en) | 1980-01-18 |
Family
ID=13677881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7900778A Pending JPS556854A (en) | 1978-06-28 | 1978-06-28 | Lead frame strength test method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS556854A (en) |
-
1978
- 1978-06-28 JP JP7900778A patent/JPS556854A/en active Pending
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