JPS5560513A - Unsaturated polyester resin composition - Google Patents
Unsaturated polyester resin compositionInfo
- Publication number
- JPS5560513A JPS5560513A JP13323578A JP13323578A JPS5560513A JP S5560513 A JPS5560513 A JP S5560513A JP 13323578 A JP13323578 A JP 13323578A JP 13323578 A JP13323578 A JP 13323578A JP S5560513 A JPS5560513 A JP S5560513A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- resin composition
- unsaturated polyester
- polyester resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polyurethanes Or Polyureas (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: To prepare a solid unsaturated polyester resin composition having excellent flowability and moldability and giving the molded articles having improved blocking resistance, electrical characteristics, etc., by compounding an unsaturated polyester with a polyisocyanate compound, a vinyl monomer, etc. at specific ratios.
CONSTITUTION: A resin composition composed mainly of (A) 10W45 parts by weight of an unsaturated polymer having a ring and ball softening point of ≥50°C, (B) 0W20 parts by weight of a polyfunctional compound having groups reactive with isocyanate groups (e.g. hydroxyl group-terminated polyester, etc.), (C) 0.2W 15 parts by weight of an isocyanate compound having two or more isocyanate groups (e.g. 4, 4'-dicyclohexylmethane diisocyanate, etc.), (D) 1W10 parts by weight of a solid copolymerizable vinyl monomer (e.g. acrylamide, etc.) and (E) 0. 2W3 parts by weight of a curing catalyst (e.g. dicumyl peroxide), and if desired, (F) fillers, reinforcing agents, a mold release agent, pigments, etc.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13323578A JPS5560513A (en) | 1978-10-31 | 1978-10-31 | Unsaturated polyester resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13323578A JPS5560513A (en) | 1978-10-31 | 1978-10-31 | Unsaturated polyester resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5560513A true JPS5560513A (en) | 1980-05-07 |
Family
ID=15099861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13323578A Pending JPS5560513A (en) | 1978-10-31 | 1978-10-31 | Unsaturated polyester resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5560513A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6119619A (en) * | 1984-07-05 | 1986-01-28 | Hitachi Chem Co Ltd | Resin composition |
US4747699A (en) * | 1985-02-06 | 1988-05-31 | Daikin Industries, Ltd. | Thermal-environment sensor with means to simulate emissivity of human body |
JPS63205312A (en) * | 1987-02-20 | 1988-08-24 | Mitsubishi Gas Chem Co Inc | Unsaturated polyester resin composition |
WO2006039647A3 (en) * | 2004-09-30 | 2006-06-01 | Sherwin Williams Co | Low bake, low voc conductive primer |
-
1978
- 1978-10-31 JP JP13323578A patent/JPS5560513A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6119619A (en) * | 1984-07-05 | 1986-01-28 | Hitachi Chem Co Ltd | Resin composition |
JPS6361332B2 (en) * | 1984-07-05 | 1988-11-29 | ||
US4747699A (en) * | 1985-02-06 | 1988-05-31 | Daikin Industries, Ltd. | Thermal-environment sensor with means to simulate emissivity of human body |
US4890932A (en) * | 1985-02-06 | 1990-01-02 | Daikin Industries, Ltd. | Thermal environment sensor with means to simulate emissivity of human body |
JPS63205312A (en) * | 1987-02-20 | 1988-08-24 | Mitsubishi Gas Chem Co Inc | Unsaturated polyester resin composition |
WO2006039647A3 (en) * | 2004-09-30 | 2006-06-01 | Sherwin Williams Co | Low bake, low voc conductive primer |
US7528190B2 (en) | 2004-09-30 | 2009-05-05 | The Sherwin-Williams Company | Low bake, low VOC conductive primer |
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