JPS555917A - Polyamide composition - Google Patents
Polyamide compositionInfo
- Publication number
- JPS555917A JPS555917A JP7736278A JP7736278A JPS555917A JP S555917 A JPS555917 A JP S555917A JP 7736278 A JP7736278 A JP 7736278A JP 7736278 A JP7736278 A JP 7736278A JP S555917 A JPS555917 A JP S555917A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- polyamide
- alkyl
- imidazole compound
- tetrahydrobenzimidazole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7736278A JPS555917A (en) | 1978-06-28 | 1978-06-28 | Polyamide composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7736278A JPS555917A (en) | 1978-06-28 | 1978-06-28 | Polyamide composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS555917A true JPS555917A (en) | 1980-01-17 |
| JPS6145662B2 JPS6145662B2 (cg-RX-API-DMAC7.html) | 1986-10-09 |
Family
ID=13631787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7736278A Granted JPS555917A (en) | 1978-06-28 | 1978-06-28 | Polyamide composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS555917A (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111892749A (zh) * | 2020-07-03 | 2020-11-06 | 浙江荣泰科技企业有限公司 | 表面吸附咪唑-铜络合物的氮化硼高导热绝缘填料及绝缘散热环氧树脂组合物及其制备方法 |
-
1978
- 1978-06-28 JP JP7736278A patent/JPS555917A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111892749A (zh) * | 2020-07-03 | 2020-11-06 | 浙江荣泰科技企业有限公司 | 表面吸附咪唑-铜络合物的氮化硼高导热绝缘填料及绝缘散热环氧树脂组合物及其制备方法 |
| CN111892749B (zh) * | 2020-07-03 | 2022-03-22 | 浙江荣泰科技企业有限公司 | 表面吸附咪唑-铜络合物的氮化硼高导热绝缘填料及绝缘散热环氧树脂组合物及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6145662B2 (cg-RX-API-DMAC7.html) | 1986-10-09 |
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