JPS5554941U - - Google Patents

Info

Publication number
JPS5554941U
JPS5554941U JP13997978U JP13997978U JPS5554941U JP S5554941 U JPS5554941 U JP S5554941U JP 13997978 U JP13997978 U JP 13997978U JP 13997978 U JP13997978 U JP 13997978U JP S5554941 U JPS5554941 U JP S5554941U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13997978U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13997978U priority Critical patent/JPS5554941U/ja
Publication of JPS5554941U publication Critical patent/JPS5554941U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)
JP13997978U 1978-10-11 1978-10-11 Pending JPS5554941U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13997978U JPS5554941U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1978-10-11 1978-10-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13997978U JPS5554941U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1978-10-11 1978-10-11

Publications (1)

Publication Number Publication Date
JPS5554941U true JPS5554941U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1980-04-14

Family

ID=29114522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13997978U Pending JPS5554941U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1978-10-11 1978-10-11

Country Status (1)

Country Link
JP (1) JPS5554941U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58155837U (ja) * 1982-04-12 1983-10-18 田中電子工業株式会社 半導体用ボンデイングワイヤ−スプ−ル

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58155837U (ja) * 1982-04-12 1983-10-18 田中電子工業株式会社 半導体用ボンデイングワイヤ−スプ−ル

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