JPS5554174A - Controller of machine that lap wafer - Google Patents

Controller of machine that lap wafer

Info

Publication number
JPS5554174A
JPS5554174A JP8997579A JP8997579A JPS5554174A JP S5554174 A JPS5554174 A JP S5554174A JP 8997579 A JP8997579 A JP 8997579A JP 8997579 A JP8997579 A JP 8997579A JP S5554174 A JPS5554174 A JP S5554174A
Authority
JP
Japan
Prior art keywords
controller
machine
lap
wafer
lap wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8997579A
Other languages
English (en)
Other versions
JPS6327149B2 (ja
Inventor
Zauaaranto Furantsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JPS5554174A publication Critical patent/JPS5554174A/ja
Publication of JPS6327149B2 publication Critical patent/JPS6327149B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP8997579A 1978-07-17 1979-07-17 Controller of machine that lap wafer Granted JPS5554174A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/924,884 US4197676A (en) 1978-07-17 1978-07-17 Apparatus for automatic lapping control

Publications (2)

Publication Number Publication Date
JPS5554174A true JPS5554174A (en) 1980-04-21
JPS6327149B2 JPS6327149B2 (ja) 1988-06-01

Family

ID=25450865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8997579A Granted JPS5554174A (en) 1978-07-17 1979-07-17 Controller of machine that lap wafer

Country Status (2)

Country Link
US (1) US4197676A (ja)
JP (1) JPS5554174A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02224969A (ja) * 1989-02-28 1990-09-06 Nippon Dempa Kogyo Co Ltd 圧電片の自動研磨装置

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55106769A (en) * 1979-01-31 1980-08-15 Masami Masuko Lapping method and its apparatus
US4407094A (en) * 1981-11-03 1983-10-04 Transat Corp. Apparatus for automatic lapping control
US4793895A (en) * 1988-01-25 1988-12-27 Ibm Corporation In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection
US4879258A (en) * 1988-08-31 1989-11-07 Texas Instruments Incorporated Integrated circuit planarization by mechanical polishing
US5175938A (en) * 1988-08-31 1993-01-05 Digital Equipment Corporation Electrical guide for tight tolerance machining
US5136817A (en) * 1990-02-28 1992-08-11 Nihon Dempa Kogyo Co., Ltd. Automatic lapping apparatus for piezoelectric materials
JPH0738106B2 (ja) * 1990-03-20 1995-04-26 ヤマハ株式会社 電子楽器の鍵盤蓋開閉機構
US5242524A (en) * 1990-05-16 1993-09-07 International Business Machines Corporation Device for detecting an end point in polishing operations
US5132617A (en) * 1990-05-16 1992-07-21 International Business Machines Corp. Method of measuring changes in impedance of a variable impedance load by disposing an impedance connected coil within the air gap of a magnetic core
US5660672A (en) * 1995-04-10 1997-08-26 International Business Machines Corporation In-situ monitoring of conductive films on semiconductor wafers
US5559428A (en) * 1995-04-10 1996-09-24 International Business Machines Corporation In-situ monitoring of the change in thickness of films
US5947799A (en) * 1996-04-05 1999-09-07 Kaoyashi; Michihiko Automatic lapping control
US6022807A (en) * 1996-04-24 2000-02-08 Micro Processing Technology, Inc. Method for fabricating an integrated circuit
US6705930B2 (en) * 2000-01-28 2004-03-16 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
US6340326B1 (en) 2000-01-28 2002-01-22 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers
US7481695B2 (en) 2000-08-22 2009-01-27 Lam Research Corporation Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
US6585572B1 (en) 2000-08-22 2003-07-01 Lam Research Corporation Subaperture chemical mechanical polishing system
US6640155B2 (en) 2000-08-22 2003-10-28 Lam Research Corporation Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head
US6652357B1 (en) 2000-09-22 2003-11-25 Lam Research Corporation Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
US6471566B1 (en) 2000-09-18 2002-10-29 Lam Research Corporation Sacrificial retaining ring CMP system and methods for implementing the same
US6443815B1 (en) 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
US6592437B1 (en) 2001-12-26 2003-07-15 Lam Research Corporation Active gimbal ring with internal gel and methods for making same
US6736720B2 (en) * 2001-12-26 2004-05-18 Lam Research Corporation Apparatus and methods for controlling wafer temperature in chemical mechanical polishing
US6937915B1 (en) * 2002-03-28 2005-08-30 Lam Research Corporation Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
US6955588B1 (en) 2004-03-31 2005-10-18 Lam Research Corporation Method of and platen for controlling removal rate characteristics in chemical mechanical planarization
US7052364B2 (en) * 2004-06-14 2006-05-30 Cabot Microelectronics Corporation Real time polishing process monitoring
JP2008227393A (ja) * 2007-03-15 2008-09-25 Fujikoshi Mach Corp ウェーハの両面研磨装置
KR101409738B1 (ko) * 2009-12-01 2014-07-02 가부시키가이샤 사무코 웨이퍼의 연마 방법
JP2012205258A (ja) * 2011-03-28 2012-10-22 Seiko Instruments Inc 研磨方法、圧電振動片の製造方法、圧電振動子、発振器、電子機器及び電波時計
CN106002529B (zh) * 2016-07-12 2019-03-29 苏州宏泉高压电容器有限公司 一种高压陶瓷电容器瓷介质芯片毛刺去除装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5190095A (ja) * 1975-02-05 1976-08-06
JPS5313893A (en) * 1976-07-23 1978-02-07 Seikosha Kk Device for detecting polished state of piezooelectric element

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2340843A (en) * 1941-08-20 1944-02-01 Bendix Aviat Corp Piezoelectric apparatus and method
US3063206A (en) * 1959-05-05 1962-11-13 Westinghouse Electric Corp Lapping machine
US3097458A (en) * 1960-05-13 1963-07-16 Method of accurately machining semiconductor bodies
US3579922A (en) * 1968-10-11 1971-05-25 Western Electric Co Apparatus for abrading articles

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5190095A (ja) * 1975-02-05 1976-08-06
JPS5313893A (en) * 1976-07-23 1978-02-07 Seikosha Kk Device for detecting polished state of piezooelectric element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02224969A (ja) * 1989-02-28 1990-09-06 Nippon Dempa Kogyo Co Ltd 圧電片の自動研磨装置

Also Published As

Publication number Publication date
US4197676A (en) 1980-04-15
JPS6327149B2 (ja) 1988-06-01

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