JPS555266B2 - - Google Patents
Info
- Publication number
- JPS555266B2 JPS555266B2 JP15945675A JP15945675A JPS555266B2 JP S555266 B2 JPS555266 B2 JP S555266B2 JP 15945675 A JP15945675 A JP 15945675A JP 15945675 A JP15945675 A JP 15945675A JP S555266 B2 JPS555266 B2 JP S555266B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15945675A JPS5283173A (en) | 1975-12-30 | 1975-12-30 | Circuit packaging substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15945675A JPS5283173A (en) | 1975-12-30 | 1975-12-30 | Circuit packaging substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5283173A JPS5283173A (en) | 1977-07-11 |
JPS555266B2 true JPS555266B2 (en) | 1980-02-05 |
Family
ID=15694147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15945675A Granted JPS5283173A (en) | 1975-12-30 | 1975-12-30 | Circuit packaging substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5283173A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61138561U (en) * | 1985-02-19 | 1986-08-28 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5833403U (en) * | 1981-08-28 | 1983-03-04 | 株式会社サト− | Strip winding tool |
US4668538A (en) * | 1984-07-10 | 1987-05-26 | Westinghouse Electric Corp. | Processes for depositing metal compound coatings |
-
1975
- 1975-12-30 JP JP15945675A patent/JPS5283173A/en active Granted
Non-Patent Citations (1)
Title |
---|
IBM JOURNAL OF RESEARCH AND DEVELOPMENT=1969 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61138561U (en) * | 1985-02-19 | 1986-08-28 |
Also Published As
Publication number | Publication date |
---|---|
JPS5283173A (en) | 1977-07-11 |