JPS555264B2 - - Google Patents

Info

Publication number
JPS555264B2
JPS555264B2 JP2094775A JP2094775A JPS555264B2 JP S555264 B2 JPS555264 B2 JP S555264B2 JP 2094775 A JP2094775 A JP 2094775A JP 2094775 A JP2094775 A JP 2094775A JP S555264 B2 JPS555264 B2 JP S555264B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2094775A
Other languages
Japanese (ja)
Other versions
JPS5196287A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2094775A priority Critical patent/JPS5196287A/ja
Publication of JPS5196287A publication Critical patent/JPS5196287A/ja
Publication of JPS555264B2 publication Critical patent/JPS555264B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/0132Binary Alloys
    • H01L2924/01322Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP2094775A 1975-02-21 1975-02-21 Handotaisoshi Granted JPS5196287A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2094775A JPS5196287A (ja) 1975-02-21 1975-02-21 Handotaisoshi

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2094775A JPS5196287A (ja) 1975-02-21 1975-02-21 Handotaisoshi

Publications (2)

Publication Number Publication Date
JPS5196287A JPS5196287A (ja) 1976-08-24
JPS555264B2 true JPS555264B2 (forum.php) 1980-02-05

Family

ID=12041381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2094775A Granted JPS5196287A (ja) 1975-02-21 1975-02-21 Handotaisoshi

Country Status (1)

Country Link
JP (1) JPS5196287A (forum.php)

Also Published As

Publication number Publication date
JPS5196287A (ja) 1976-08-24

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