JPS555242A - Method of cutting off surface protective film - Google Patents

Method of cutting off surface protective film

Info

Publication number
JPS555242A
JPS555242A JP7642678A JP7642678A JPS555242A JP S555242 A JPS555242 A JP S555242A JP 7642678 A JP7642678 A JP 7642678A JP 7642678 A JP7642678 A JP 7642678A JP S555242 A JPS555242 A JP S555242A
Authority
JP
Japan
Prior art keywords
cutting
protective film
surface protective
film
protective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7642678A
Other languages
Japanese (ja)
Inventor
Sadao Yamamoto
Kenji Takemura
Chikao Furuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP7642678A priority Critical patent/JPS555242A/en
Publication of JPS555242A publication Critical patent/JPS555242A/en
Pending legal-status Critical Current

Links

Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
JP7642678A 1978-06-26 1978-06-26 Method of cutting off surface protective film Pending JPS555242A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7642678A JPS555242A (en) 1978-06-26 1978-06-26 Method of cutting off surface protective film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7642678A JPS555242A (en) 1978-06-26 1978-06-26 Method of cutting off surface protective film

Publications (1)

Publication Number Publication Date
JPS555242A true JPS555242A (en) 1980-01-16

Family

ID=13604834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7642678A Pending JPS555242A (en) 1978-06-26 1978-06-26 Method of cutting off surface protective film

Country Status (1)

Country Link
JP (1) JPS555242A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6090700A (en) * 1983-10-21 1985-05-21 株式会社デイスコ内 Device for cutting sheet-shaped member stuck on semiconductor wafer
JPS60231328A (en) * 1984-04-27 1985-11-16 Disco Abrasive Sys Ltd Apparatus for cutting sheet member stuck to semiconductor wafer
JPS61284926A (en) * 1985-06-10 1986-12-15 Teikoku Seiki Kk Method for cutting and removing masking sheet for processing silicon wafer
US4969765A (en) * 1984-12-29 1990-11-13 Ogawa Chemical Industries Ltd. Mechanical marking pen

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6090700A (en) * 1983-10-21 1985-05-21 株式会社デイスコ内 Device for cutting sheet-shaped member stuck on semiconductor wafer
JPS60231328A (en) * 1984-04-27 1985-11-16 Disco Abrasive Sys Ltd Apparatus for cutting sheet member stuck to semiconductor wafer
US4969765A (en) * 1984-12-29 1990-11-13 Ogawa Chemical Industries Ltd. Mechanical marking pen
JPS61284926A (en) * 1985-06-10 1986-12-15 Teikoku Seiki Kk Method for cutting and removing masking sheet for processing silicon wafer
JPH0516659B2 (en) * 1985-06-10 1993-03-05 Teikoku Seiki Kk

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