JPS5550997Y2 - - Google Patents
Info
- Publication number
- JPS5550997Y2 JPS5550997Y2 JP9650875U JP9650875U JPS5550997Y2 JP S5550997 Y2 JPS5550997 Y2 JP S5550997Y2 JP 9650875 U JP9650875 U JP 9650875U JP 9650875 U JP9650875 U JP 9650875U JP S5550997 Y2 JPS5550997 Y2 JP S5550997Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9650875U JPS5550997Y2 (en:Method) | 1975-07-10 | 1975-07-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9650875U JPS5550997Y2 (en:Method) | 1975-07-10 | 1975-07-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5210770U JPS5210770U (en:Method) | 1977-01-25 |
| JPS5550997Y2 true JPS5550997Y2 (en:Method) | 1980-11-27 |
Family
ID=28578221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9650875U Expired JPS5550997Y2 (en:Method) | 1975-07-10 | 1975-07-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5550997Y2 (en:Method) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54111767A (en) * | 1978-02-21 | 1979-09-01 | Nec Corp | Manufacture for semiconductor device |
| JPH01109320A (ja) * | 1987-10-23 | 1989-04-26 | Tanaka Sangyo:Kk | めがねフレームとパッドの固着構造 |
-
1975
- 1975-07-10 JP JP9650875U patent/JPS5550997Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5210770U (en:Method) | 1977-01-25 |