JPS5550081A - Hot-melt bonding film - Google Patents

Hot-melt bonding film

Info

Publication number
JPS5550081A
JPS5550081A JP12318378A JP12318378A JPS5550081A JP S5550081 A JPS5550081 A JP S5550081A JP 12318378 A JP12318378 A JP 12318378A JP 12318378 A JP12318378 A JP 12318378A JP S5550081 A JPS5550081 A JP S5550081A
Authority
JP
Japan
Prior art keywords
adhesion
poor
hot
amount
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12318378A
Other languages
Japanese (ja)
Other versions
JPS5831114B2 (en
Inventor
Makoto Tsunoda
Toshiharu Naito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KYOEI KK
Original Assignee
KYOEI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KYOEI KK filed Critical KYOEI KK
Priority to JP53123183A priority Critical patent/JPS5831114B2/en
Publication of JPS5550081A publication Critical patent/JPS5550081A/en
Publication of JPS5831114B2 publication Critical patent/JPS5831114B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: A hot-melt bonding film having improved aging, heat, and chemical resistance, and toughness, prepared by forming a blend of ethylene-vinyl acetate copolymer, styrene-butadiene rubber, and an ABS resin into a film.
CONSTITUTION: A blend of (A) 10W70wt% of ethylene-vinyl acetate copolymer, (B) 10W80wt% of styrene-butadiene rubber, and (C) 10W50wt% of an ABS resin is formed into a film. If the amounts of (A) and (B) are less then 10wt% respectively, the adhesion is poor. If the amount of (A) is larger than 70wt% or that of (B) exceeds 80wt%, the adhesion is poor. If the amount of (C) is less than 10wt%, the low chemical resistance results in peeling. If the amount of (C) exceeds 50wt%, the adhesion is poor.
EFFECT: Sufficient adhesion can be retained even at a high temperature of about 80°C.
COPYRIGHT: (C)1980,JPO&Japio
JP53123183A 1978-10-05 1978-10-05 Hot melt adhesive film Expired JPS5831114B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53123183A JPS5831114B2 (en) 1978-10-05 1978-10-05 Hot melt adhesive film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53123183A JPS5831114B2 (en) 1978-10-05 1978-10-05 Hot melt adhesive film

Publications (2)

Publication Number Publication Date
JPS5550081A true JPS5550081A (en) 1980-04-11
JPS5831114B2 JPS5831114B2 (en) 1983-07-04

Family

ID=14854236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53123183A Expired JPS5831114B2 (en) 1978-10-05 1978-10-05 Hot melt adhesive film

Country Status (1)

Country Link
JP (1) JPS5831114B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003046099A1 (en) * 2001-11-30 2003-06-05 Auckland Uniservices Limited Water-based adhesive compositions

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4948736A (en) * 1972-09-09 1974-05-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4948736A (en) * 1972-09-09 1974-05-11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003046099A1 (en) * 2001-11-30 2003-06-05 Auckland Uniservices Limited Water-based adhesive compositions

Also Published As

Publication number Publication date
JPS5831114B2 (en) 1983-07-04

Similar Documents

Publication Publication Date Title
JPS52132043A (en) Vinyl acetate-ethylene copolymer emulsion for pressure-sensitive adhesive
JPS5268279A (en) Composite films of polypropylene withexcellent processability
JPS53129234A (en) Composition for hot-melt adhesive
JPS5550081A (en) Hot-melt bonding film
JPS53127546A (en) Polyolefin composition having improved adhesiveness
JPS51115541A (en) Adhesive composition
JPS52127940A (en) Hot-melt adhesives of polyesters
JPS51149385A (en) A process for manufacturing laminates
JPS53147733A (en) Resin composition with bonding properties
JPS52829A (en) Hot-melt coating composition for use in heat sealing
JPS51122152A (en) Polyolefin composition with excellent adhesion to metals
JPS5238549A (en) Adhesive composition
JPS5221048A (en) Hot melt composition
JPS543148A (en) Thermoplastic elastomeric composition
JPS57202334A (en) Film for agriculture
JPS54127441A (en) Hot-melt adhesive composition
JPS539839A (en) Preparation of ehat resistant pressure-sensitive tape
JPS53117035A (en) Pressure-sensitive
JPS5361631A (en) Polychloroprene adhesive compositions
JPS52121644A (en) Adhesive composition and adhesive tape
JPS5293454A (en) Novel emulsion composition
JPS5534271A (en) Propylene resin composition
JPS51126230A (en) Method of making tapes coated with remoistening adhesive
JPS51132226A (en) Adhesives
JPS5237937A (en) Hot-melt type adhesive composition