JPS554908A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS554908A
JPS554908A JP7646178A JP7646178A JPS554908A JP S554908 A JPS554908 A JP S554908A JP 7646178 A JP7646178 A JP 7646178A JP 7646178 A JP7646178 A JP 7646178A JP S554908 A JPS554908 A JP S554908A
Authority
JP
Japan
Prior art keywords
leads
tips
inner leads
bars
tie
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7646178A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6156621B2 (enExample
Inventor
Akira Suzuki
Tokio Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7646178A priority Critical patent/JPS554908A/ja
Publication of JPS554908A publication Critical patent/JPS554908A/ja
Publication of JPS6156621B2 publication Critical patent/JPS6156621B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP7646178A 1978-06-26 1978-06-26 Lead frame Granted JPS554908A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7646178A JPS554908A (en) 1978-06-26 1978-06-26 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7646178A JPS554908A (en) 1978-06-26 1978-06-26 Lead frame

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP59152903A Division JPS6035551A (ja) 1984-07-25 1984-07-25 半導体装置の製法

Publications (2)

Publication Number Publication Date
JPS554908A true JPS554908A (en) 1980-01-14
JPS6156621B2 JPS6156621B2 (enExample) 1986-12-03

Family

ID=13605793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7646178A Granted JPS554908A (en) 1978-06-26 1978-06-26 Lead frame

Country Status (1)

Country Link
JP (1) JPS554908A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56174664U (enExample) * 1980-05-27 1981-12-23
JPS5727050A (en) * 1980-07-25 1982-02-13 Hitachi Ltd Lead frame and semiconductor device using said lead frame
JPS58180047A (ja) * 1982-04-15 1983-10-21 Matsushita Electric Ind Co Ltd 半導体収納容器および半導体装置の製造方法
JPS6222466A (ja) * 1985-07-22 1987-01-30 Nec Yamagata Ltd 集積回路装置用リ−ドフレ−ムの製造方法
JPH01142770U (enExample) * 1988-03-26 1989-09-29
JPH0498971U (enExample) * 1991-02-05 1992-08-26

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56174664U (enExample) * 1980-05-27 1981-12-23
JPS5727050A (en) * 1980-07-25 1982-02-13 Hitachi Ltd Lead frame and semiconductor device using said lead frame
JPS58180047A (ja) * 1982-04-15 1983-10-21 Matsushita Electric Ind Co Ltd 半導体収納容器および半導体装置の製造方法
JPS6222466A (ja) * 1985-07-22 1987-01-30 Nec Yamagata Ltd 集積回路装置用リ−ドフレ−ムの製造方法
JPH01142770U (enExample) * 1988-03-26 1989-09-29
JPH0498971U (enExample) * 1991-02-05 1992-08-26

Also Published As

Publication number Publication date
JPS6156621B2 (enExample) 1986-12-03

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