JPS5547733U - - Google Patents

Info

Publication number
JPS5547733U
JPS5547733U JP1978129884U JP12988478U JPS5547733U JP S5547733 U JPS5547733 U JP S5547733U JP 1978129884 U JP1978129884 U JP 1978129884U JP 12988478 U JP12988478 U JP 12988478U JP S5547733 U JPS5547733 U JP S5547733U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1978129884U
Other languages
Japanese (ja)
Other versions
JPS5726379Y2 (US20100012521A1-20100121-C00001.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1978129884U priority Critical patent/JPS5726379Y2/ja
Priority to US06/074,471 priority patent/US4326239A/en
Priority to CA335,683A priority patent/CA1130012A/en
Priority to DE19792937886 priority patent/DE2937886A1/de
Priority to PH23050A priority patent/PH18592A/en
Priority to GB7932571A priority patent/GB2032190B/en
Priority to NL7907015A priority patent/NL7907015A/nl
Publication of JPS5547733U publication Critical patent/JPS5547733U/ja
Application granted granted Critical
Publication of JPS5726379Y2 publication Critical patent/JPS5726379Y2/ja
Priority to SG146/84A priority patent/SG14684G/en
Priority to HK574/84A priority patent/HK57484A/xx
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305Affixing by adhesive
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0269Marks, test patterns or identification means for visual or optical inspection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772Conductors directly under a component but not electrically connected to the component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10583Cylindrically shaped component; Fixing means therefore
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10636Leadless chip, e.g. chip capacitor or resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/161Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/168Wrong mounting prevention
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452Solder masks
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1978129884U 1978-09-21 1978-09-21 Expired JPS5726379Y2 (US20100012521A1-20100121-C00001.png)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP1978129884U JPS5726379Y2 (US20100012521A1-20100121-C00001.png) 1978-09-21 1978-09-21
US06/074,471 US4326239A (en) 1978-09-21 1979-09-11 Printed circuit board
CA335,683A CA1130012A (en) 1978-09-21 1979-09-14 Printed circuit board
DE19792937886 DE2937886A1 (de) 1978-09-21 1979-09-19 Leiterplatte fuer gedruckte schaltung
PH23050A PH18592A (en) 1978-09-21 1979-09-20 Printed circuit board
GB7932571A GB2032190B (en) 1978-09-21 1979-09-20 Printed circuit boards
NL7907015A NL7907015A (nl) 1978-09-21 1979-09-20 Bord of andere drager met gedrukte bedrading.
SG146/84A SG14684G (en) 1978-09-21 1984-02-22 Printed circuit boards
HK574/84A HK57484A (en) 1978-09-21 1984-07-26 Printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978129884U JPS5726379Y2 (US20100012521A1-20100121-C00001.png) 1978-09-21 1978-09-21

Publications (2)

Publication Number Publication Date
JPS5547733U true JPS5547733U (US20100012521A1-20100121-C00001.png) 1980-03-28
JPS5726379Y2 JPS5726379Y2 (US20100012521A1-20100121-C00001.png) 1982-06-08

Family

ID=15020709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978129884U Expired JPS5726379Y2 (US20100012521A1-20100121-C00001.png) 1978-09-21 1978-09-21

Country Status (9)

Country Link
US (1) US4326239A (US20100012521A1-20100121-C00001.png)
JP (1) JPS5726379Y2 (US20100012521A1-20100121-C00001.png)
CA (1) CA1130012A (US20100012521A1-20100121-C00001.png)
DE (1) DE2937886A1 (US20100012521A1-20100121-C00001.png)
GB (1) GB2032190B (US20100012521A1-20100121-C00001.png)
HK (1) HK57484A (US20100012521A1-20100121-C00001.png)
NL (1) NL7907015A (US20100012521A1-20100121-C00001.png)
PH (1) PH18592A (US20100012521A1-20100121-C00001.png)
SG (1) SG14684G (US20100012521A1-20100121-C00001.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6419587U (US20100012521A1-20100121-C00001.png) * 1987-07-27 1989-01-31

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4489365A (en) * 1982-09-17 1984-12-18 Burroughs Corporation Universal leadless chip carrier mounting pad
GB2147148A (en) * 1983-09-27 1985-05-01 John Patrick Burke Electronic circuit assembly
DE3414552A1 (de) * 1984-04-17 1985-10-17 geb. Baur Christine 8042 Oberschleißheim Irnstetter Verfahren und vorrichtung zur montage anschlussleiterloser elektrischer bauelemente
US4641222A (en) * 1984-05-29 1987-02-03 Motorola, Inc. Mounting system for stress relief in surface mounted components
AT389793B (de) * 1986-03-25 1990-01-25 Philips Nv Leiterplatte fuer gedruckte schaltungen und verfahren zur herstellung solcher leiterplatten
DE3619212A1 (de) * 1986-06-07 1987-12-10 Philips Patentverwaltung Passives elektrisches bauelement
US4777564A (en) * 1986-10-16 1988-10-11 Motorola, Inc. Leadform for use with surface mounted components
GB2200801B (en) * 1986-12-25 1991-01-09 Tdk Corp Electronic circuit element
GB2211667A (en) * 1986-12-29 1989-07-05 Motorola Inc Method for inspecting printed circuit boards for missing or misplaced components
US4843036A (en) * 1987-06-29 1989-06-27 Eastman Kodak Company Method for encapsulating electronic devices
US4869671A (en) * 1988-02-22 1989-09-26 Instrument Specialties Co., Inc. Electrical connector for printed circuit board
US4859808A (en) * 1988-06-28 1989-08-22 Delco Electronics Corporation Electrical conductor having unique solder dam configuration
US4893216A (en) * 1988-08-09 1990-01-09 Northern Telecom Limited Circuit board and method of soldering
US5726861A (en) * 1995-01-03 1998-03-10 Ostrem; Fred E. Surface mount component height control
US5835006A (en) * 1996-05-22 1998-11-10 Moorola, Inc. Vibrator assembly
US6060169A (en) * 1997-11-24 2000-05-09 International Business Machines Corporation Coating Material and method for providing asset protection
US6190759B1 (en) 1998-02-18 2001-02-20 International Business Machines Corporation High optical contrast resin composition and electronic package utilizing same
EP1779421A1 (en) * 2004-08-06 2007-05-02 Hitek Power Corporation Selective encapsulation of electronic components
JP2019165043A (ja) * 2018-03-19 2019-09-26 日立オートモティブシステムズ株式会社 電子回路装置および回路基板の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5253356U (US20100012521A1-20100121-C00001.png) * 1975-10-15 1977-04-16
JPS52170257U (US20100012521A1-20100121-C00001.png) * 1976-06-18 1977-12-24

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2804607A (en) * 1954-07-02 1957-08-27 Jr George S Nalle Dispatcher's board with movable facing sections
DE1882564U (de) * 1963-02-21 1963-11-14 Philips Patentverwaltung Isolierplatte mit flaechenhaften leitungszuegen.
US3296360A (en) * 1965-01-04 1967-01-03 Gen Electric Electrical isolation means for components on a printed circuit board
US3410949A (en) * 1967-10-16 1968-11-12 Tischler Morris Plastic embedded color-coded printed circuit
DE1937009A1 (de) * 1969-07-21 1971-01-28 Siemens Ag Kontaktfreie UEberkreuzung von Leitbahnen
US3621116A (en) * 1969-12-29 1971-11-16 Bertram C Adams Printed circuit board
US3917984A (en) * 1974-10-01 1975-11-04 Microsystems Int Ltd Printed circuit board for mounting and connecting a plurality of semiconductor devices
US3955023A (en) * 1974-11-01 1976-05-04 Texas Instruments Incorporated Black dielectric mask on white substrate
US3989338A (en) * 1974-11-08 1976-11-02 Gosser Robert B Push-pin assembly method and construction
US4164778A (en) * 1976-07-20 1979-08-14 Matsushita Electric Industrial Co., Ltd. Printed circuit board
US4130722A (en) * 1977-01-10 1978-12-19 Globe-Union Inc. Thick-film circuit module including a monolithic ceramic cross-over device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5253356U (US20100012521A1-20100121-C00001.png) * 1975-10-15 1977-04-16
JPS52170257U (US20100012521A1-20100121-C00001.png) * 1976-06-18 1977-12-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6419587U (US20100012521A1-20100121-C00001.png) * 1987-07-27 1989-01-31

Also Published As

Publication number Publication date
US4326239A (en) 1982-04-20
PH18592A (en) 1985-08-12
GB2032190A (en) 1980-04-30
GB2032190B (en) 1983-03-23
DE2937886A1 (de) 1980-04-03
JPS5726379Y2 (US20100012521A1-20100121-C00001.png) 1982-06-08
DE2937886C2 (US20100012521A1-20100121-C00001.png) 1988-06-01
CA1130012A (en) 1982-08-17
NL7907015A (nl) 1980-03-25
HK57484A (en) 1984-08-03
SG14684G (en) 1985-02-15

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