JPS5547469B2 - - Google Patents

Info

Publication number
JPS5547469B2
JPS5547469B2 JP11008773A JP11008773A JPS5547469B2 JP S5547469 B2 JPS5547469 B2 JP S5547469B2 JP 11008773 A JP11008773 A JP 11008773A JP 11008773 A JP11008773 A JP 11008773A JP S5547469 B2 JPS5547469 B2 JP S5547469B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11008773A
Other languages
Japanese (ja)
Other versions
JPS4978489A (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19722253489 external-priority patent/DE2253489C3/de
Application filed filed Critical
Publication of JPS4978489A publication Critical patent/JPS4978489A/ja
Publication of JPS5547469B2 publication Critical patent/JPS5547469B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/10Arrangements for heating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/20Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07541Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07552Controlling the environment, e.g. atmosphere composition or temperature changes in structures or sizes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/521Structures or relative sizes of bond wires
    • H10W72/527Multiple bond wires having different sizes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/536Shapes of wire connectors the connected ends being ball-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/921Structures or relative sizes of bond pads
    • H10W72/926Multiple bond pads having different sizes

Landscapes

  • Thyristors (AREA)
JP11008773A 1972-10-31 1973-09-28 Expired JPS5547469B2 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722253489 DE2253489C3 (de) 1972-10-31 Thyristor und Verfahren zu seiner Herstellung

Publications (2)

Publication Number Publication Date
JPS4978489A JPS4978489A (https=) 1974-07-29
JPS5547469B2 true JPS5547469B2 (https=) 1980-11-29

Family

ID=5860568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11008773A Expired JPS5547469B2 (https=) 1972-10-31 1973-09-28

Country Status (5)

Country Link
JP (1) JPS5547469B2 (https=)
BE (1) BE806821A (https=)
CH (1) CH553480A (https=)
FR (1) FR2204895B1 (https=)
IT (1) IT998994B (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5756527Y2 (https=) * 1977-02-25 1982-12-04

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1095576A (https=) * 1964-08-12 1900-01-01
DE1614410B2 (de) * 1967-01-25 1973-12-13 Siemens Ag, 1000 Berlin U. 8000 Muenchen Halbleiterbauelement
US3538401A (en) * 1968-04-11 1970-11-03 Westinghouse Electric Corp Drift field thyristor
FR2007870B1 (https=) * 1968-05-06 1975-01-10 Rca Corp

Also Published As

Publication number Publication date
IT998994B (it) 1976-02-20
DE2253489B2 (de) 1977-04-28
FR2204895A1 (https=) 1974-05-24
DE2253489A1 (de) 1974-05-02
FR2204895B1 (https=) 1978-02-10
BE806821A (fr) 1974-02-15
JPS4978489A (https=) 1974-07-29
CH553480A (de) 1974-08-30

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