JPS5546933A - High frequency induction melting and bonding of resinous cloth - Google Patents

High frequency induction melting and bonding of resinous cloth

Info

Publication number
JPS5546933A
JPS5546933A JP12003678A JP12003678A JPS5546933A JP S5546933 A JPS5546933 A JP S5546933A JP 12003678 A JP12003678 A JP 12003678A JP 12003678 A JP12003678 A JP 12003678A JP S5546933 A JPS5546933 A JP S5546933A
Authority
JP
Japan
Prior art keywords
mold
resinous
high frequency
frequency induction
sole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12003678A
Other languages
Japanese (ja)
Inventor
Isuke Taniguchi
Yasuhiko Shinokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AIWA SOGYO KK
AIWA SOUGIYOU KK
Original Assignee
AIWA SOGYO KK
AIWA SOUGIYOU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AIWA SOGYO KK, AIWA SOUGIYOU KK filed Critical AIWA SOGYO KK
Priority to JP12003678A priority Critical patent/JPS5546933A/en
Publication of JPS5546933A publication Critical patent/JPS5546933A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

PURPOSE: To provide an apparatus for malting and bonding thick resinous working together by applying high frequency induction, comprising a middle positioned mold holding a thick resinous working, a pair of upper and lower molds arranged to hold the middle mold inbetween, and a change-over switch for the high frequency induction.
CONSTITUTION: When each component of a slipper held by a mold 11, 15, or 16 is given high frequency induction at the switching position as shown by solid lines in the drawing, the differently polarizied bottom mold 11 and upper mold 15 come to press and melt a resinous sole 1 and a resinous intermediate sole 2 in the front and middle parts to bond together. Further, when switches 26 and 27 are changed over to a circuit as shown by dotted lines in the same drawing, the similarly polarized bottom mold 11 and upper mold 15 and the differently polarized middle mold 16 come to work to press and melt the portion held commonly by the bottom, upper and middle molds, 11, 15 and 16, i.e., a heel portion 4 to be bonded to the sole 1 and the imtermediate sole 2 in the rear part at a single charge, followed by removing the molds to leave the finished slipper.
COPYRIGHT: (C)1980,JPO&Japio
JP12003678A 1978-09-28 1978-09-28 High frequency induction melting and bonding of resinous cloth Pending JPS5546933A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12003678A JPS5546933A (en) 1978-09-28 1978-09-28 High frequency induction melting and bonding of resinous cloth

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12003678A JPS5546933A (en) 1978-09-28 1978-09-28 High frequency induction melting and bonding of resinous cloth

Publications (1)

Publication Number Publication Date
JPS5546933A true JPS5546933A (en) 1980-04-02

Family

ID=14776310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12003678A Pending JPS5546933A (en) 1978-09-28 1978-09-28 High frequency induction melting and bonding of resinous cloth

Country Status (1)

Country Link
JP (1) JPS5546933A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61203311A (en) * 1985-03-07 1986-09-09 新日鐵化学株式会社 Method and device for cutting packaged bundled material
JPS63123409U (en) * 1987-02-05 1988-08-11
EP0633127A2 (en) * 1993-07-08 1995-01-11 W.R. Grace & Co.-Conn. Method and apparatus for producing medical pouches

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61203311A (en) * 1985-03-07 1986-09-09 新日鐵化学株式会社 Method and device for cutting packaged bundled material
JPS63123409U (en) * 1987-02-05 1988-08-11
EP0633127A2 (en) * 1993-07-08 1995-01-11 W.R. Grace & Co.-Conn. Method and apparatus for producing medical pouches
EP0633127A3 (en) * 1993-07-08 1996-03-06 Grace W R & Co Method and apparatus for producing medical pouches.

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