JPS55464B1 - - Google Patents
Info
- Publication number
- JPS55464B1 JPS55464B1 JP4802171A JP4802171A JPS55464B1 JP S55464 B1 JPS55464 B1 JP S55464B1 JP 4802171 A JP4802171 A JP 4802171A JP 4802171 A JP4802171 A JP 4802171A JP S55464 B1 JPS55464 B1 JP S55464B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4802171A JPS55464B1 (sv) | 1971-07-02 | 1971-07-02 | |
| DE19722232277 DE2232277A1 (de) | 1971-07-02 | 1972-06-30 | Bad fuer elektrodenlose verkupferung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4802171A JPS55464B1 (sv) | 1971-07-02 | 1971-07-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55464B1 true JPS55464B1 (sv) | 1980-01-08 |
Family
ID=12791643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4802171A Pending JPS55464B1 (sv) | 1971-07-02 | 1971-07-02 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS55464B1 (sv) |
| DE (1) | DE2232277A1 (sv) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE441530B (sv) * | 1980-12-09 | 1985-10-14 | Ericsson Telefon Ab L M | Sett och bad for att utfora stromlos forkoppring |
| EP0109015A1 (en) * | 1982-11-15 | 1984-05-23 | Shipley Company Inc. | Electroless copper plating |
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1971
- 1971-07-02 JP JP4802171A patent/JPS55464B1/ja active Pending
-
1972
- 1972-06-30 DE DE19722232277 patent/DE2232277A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE2232277A1 (de) | 1973-01-18 |