JPS5543657U - - Google Patents

Info

Publication number
JPS5543657U
JPS5543657U JP12613478U JP12613478U JPS5543657U JP S5543657 U JPS5543657 U JP S5543657U JP 12613478 U JP12613478 U JP 12613478U JP 12613478 U JP12613478 U JP 12613478U JP S5543657 U JPS5543657 U JP S5543657U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12613478U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12613478U priority Critical patent/JPS5543657U/ja
Publication of JPS5543657U publication Critical patent/JPS5543657U/ja
Pending legal-status Critical Current

Links

JP12613478U 1978-09-13 1978-09-13 Pending JPS5543657U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12613478U JPS5543657U (en) 1978-09-13 1978-09-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12613478U JPS5543657U (en) 1978-09-13 1978-09-13

Publications (1)

Publication Number Publication Date
JPS5543657U true JPS5543657U (en) 1980-03-21

Family

ID=29087673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12613478U Pending JPS5543657U (en) 1978-09-13 1978-09-13

Country Status (1)

Country Link
JP (1) JPS5543657U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989008527A1 (en) * 1988-03-17 1989-09-21 Apollo Seiko Ltd. Method and apparatus for removing defective solder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989008527A1 (en) * 1988-03-17 1989-09-21 Apollo Seiko Ltd. Method and apparatus for removing defective solder

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