JPS5543640B2 - - Google Patents
Info
- Publication number
- JPS5543640B2 JPS5543640B2 JP12758574A JP12758574A JPS5543640B2 JP S5543640 B2 JPS5543640 B2 JP S5543640B2 JP 12758574 A JP12758574 A JP 12758574A JP 12758574 A JP12758574 A JP 12758574A JP S5543640 B2 JPS5543640 B2 JP S5543640B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12758574A JPS5543640B2 (enExample) | 1974-11-07 | 1974-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12758574A JPS5543640B2 (enExample) | 1974-11-07 | 1974-11-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5154260A JPS5154260A (enExample) | 1976-05-13 |
| JPS5543640B2 true JPS5543640B2 (enExample) | 1980-11-07 |
Family
ID=14963693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12758574A Expired JPS5543640B2 (enExample) | 1974-11-07 | 1974-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5543640B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54141564A (en) * | 1978-04-25 | 1979-11-02 | Nec Corp | Semiconductor device |
| US4360289A (en) * | 1980-06-30 | 1982-11-23 | International Business Machines Corporation | Pin for brazing to a substrate and improved package resulting therefrom |
| JPS583255A (ja) * | 1981-06-30 | 1983-01-10 | Tanaka Kikinzoku Kogyo Kk | 集積回路装置用リ−ドピン |
| JPS59182943U (ja) * | 1983-05-20 | 1984-12-06 | 三洋電機株式会社 | Ｉｃ用パツケ−ジ |
| JP2711848B2 (ja) * | 1988-03-15 | 1998-02-10 | 富士通 株式会社 | ガラスセラミック基板と入出力用ピンの接合構造 |
| JP2904274B2 (ja) * | 1997-10-28 | 1999-06-14 | 日本電気株式会社 | Ｌｓｉパッケージの実装方法 |
-
1974
- 1974-11-07 JP JP12758574A patent/JPS5543640B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5154260A (enExample) | 1976-05-13 |