JPS5542447Y2 - - Google Patents
Info
- Publication number
- JPS5542447Y2 JPS5542447Y2 JP1975116167U JP11616775U JPS5542447Y2 JP S5542447 Y2 JPS5542447 Y2 JP S5542447Y2 JP 1975116167 U JP1975116167 U JP 1975116167U JP 11616775 U JP11616775 U JP 11616775U JP S5542447 Y2 JPS5542447 Y2 JP S5542447Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975116167U JPS5542447Y2 (en:Method) | 1975-08-22 | 1975-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975116167U JPS5542447Y2 (en:Method) | 1975-08-22 | 1975-08-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5229062U JPS5229062U (en:Method) | 1977-03-01 |
| JPS5542447Y2 true JPS5542447Y2 (en:Method) | 1980-10-04 |
Family
ID=28597097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975116167U Expired JPS5542447Y2 (en:Method) | 1975-08-22 | 1975-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5542447Y2 (en:Method) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5989820U (ja) * | 1982-12-07 | 1984-06-18 | 柳井紙工株式会社 | 組立箱 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4851590A (en:Method) * | 1971-10-27 | 1973-07-19 |
-
1975
- 1975-08-22 JP JP1975116167U patent/JPS5542447Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5229062U (en:Method) | 1977-03-01 |